发明授权
- 专利标题： Method for testing integrated circuits on a carrier substrate
- 专利标题（中）： 在载体基板上测试集成电路的方法
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申请号： US887995申请日： 1992-05-22
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公开(公告)号： US5290710A公开(公告)日： 1994-03-01
- 发明人: Javad Haj-Ali-Ahmadi , Jerome A. Frankeny , Richard F. Frankeny , Adolph B. Habich , Karl Hermann , Ronald E. Hunt
- 申请人： Javad Haj-Ali-Ahmadi , Jerome A. Frankeny , Richard F. Frankeny , Adolph B. Habich , Karl Hermann , Ronald E. Hunt
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： G01R31/28
- IPC分类号： G01R31/28 ; G01R31/30 ; H01L21/00 ; H01L21/60 ; H01L21/66 ; H05K13/08 ; H01L21/52 ; H01L21/58
摘要：
A method and apparatus is provided for testing integrated circuits and permanently affixing the ICs which are successfully tested to a product level carrier substrate. A modular test oven is used which allows the chips to be electrically and thermally tested with the chips non-permanently affixed to a carrier substrate. If all of the chips on the carrier substrate test good, then the temperature within the oven is elevated, thereby reflowing the solder balls and permanently affixing the chips to the carrier substrate.
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