发明授权
- 专利标题： Moisture-proof electrical circuit high density interconnect module and method for making same
- 专利标题（中）： 防潮电路高密度互连模块及其制造方法
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申请号： US791690申请日： 1991-11-14
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公开(公告)号： US5291066A公开(公告)日： 1994-03-01
- 发明人: Constantine A. Neugebauer , Herbert S. Cole , Eugene L. Bartels , Raymond A. Fillion
- 申请人： Constantine A. Neugebauer , Herbert S. Cole , Eugene L. Bartels , Raymond A. Fillion
- 申请人地址： NY Schenectady
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： NY Schenectady
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/10 ; H01L23/538 ; H01L23/02
摘要：
A moisture-proof integrated circuit module includes at least one integrated circuit component in a high density interconnect (HDI) structure fabricated by applying to a substrate successive multiple ply sequences having a plurality of via holes therein. The sequences overlie the component(s) and the module substrate, and each sequence includes a dielectric film and a plurality of lands comprised of metal that extends into the vias of the sequence to provide electrical interconnections. The module includes at least one moisture barrier film to prevent penetration of moisture through the module to the circuit component(s).
公开/授权文献
- US5789056A Thin film magnetic disk with chromium-titanium seed layer 公开/授权日：1998-08-04
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