An automatic wafer transfer apparatus for transferring at once a plurality of wafers from a wafer basket to an etching drum which can be opened and closed by means of a movable housing and a horizontal set bar, to contain wafers therein; the wafer transfer apparatus comprising an elevator for elevating and lowering wafers, adapted to reciprocate vertically such that its top surface can pass through the etching drum to carry in the wafers, and the movable housing and the set bar of the etching drum for opening and closing the etching drum.