发明授权
- 专利标题： Apparatus for polishing chamfers of a wafer
- 专利标题（中）： 用于抛光晶片倒角的装置
-
申请号： US980358申请日： 1992-11-23
-
公开(公告)号： US5317836A公开(公告)日： 1994-06-07
- 发明人: Fumihiko Hasegawa , Masayuki Yamada , Hiroshi Kawano , Tatsuo Ohtani
- 申请人： Fumihiko Hasegawa , Masayuki Yamada , Hiroshi Kawano , Tatsuo Ohtani
- 申请人地址： JPX
- 专利权人： Shin-Etsu Handotai Co., Ltd.
- 当前专利权人： Shin-Etsu Handotai Co., Ltd.
- 当前专利权人地址： JPX
- 优先权： JPX3-335955 19911127
- 主分类号： B24B9/00
- IPC分类号： B24B9/00 ; B23Q1/36 ; B24B9/06 ; H01L21/304
摘要：
An apparatus for polishing edge chamfers of a semiconductor wafer to mirror gloss, having a rotatory cylindrical buff formed with annular groove(s) in its side and a wafer vacuum holder capable of holding and turning the wafer circumferentially, wherein the cylindrical buff is adapted to shift axially, and the annular groove has a width substantially greater than the thickness of the wafer, and a drive mechanism for axially biasing the cylindrical buff is provided.
公开/授权文献
信息查询
