发明授权
US5326490A Surface tension sulfuric acid composition 失效
低表面张力硫酸组成

Surface tension sulfuric acid composition
摘要:
Sulfuric acid or sulfuric acid/hydrogen peroxide cleaning solutions used in semiconductor manufacturing processes are improved in wettability and cleaning effect by lowering their surface tension through the addition of surface-active agents Of the general formula R.sup.1 SO.sub.2 NR.sup.2 C.sub.2 H.sub.4 OA(I) wherein R.sup.1 stands for a fluoroalkyl group, R.sup.2 for H or a lower alkyl group and A for H or SO.sub.3 H.
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