A process for tinning plated wire involves first the placing of the wire in a suitable chemical flux for a period of time, the wire is then immersed for a period of time into a static solder pot having molten solder therein, the wire is then re-immersed into the chemical flux for a period of time, and finally the wire is immersed for a period of time into an ultrasonic solder pot having molten solder therein, the wire when removed from the ultrasonic pot being sufficiently tinned such that the solder has formed a suitable intermolecular bond to the plating in accordance with typical bonding criteria.