发明授权
- 专利标题： Method for manufacture of multilayer circuit board
- 专利标题（中）： 多层电路板的制造方法
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申请号： US59912申请日： 1993-05-10
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公开(公告)号： US5334488A公开(公告)日： 1994-08-02
- 发明人: Charles R. Shipley, Jr.
- 申请人： Charles R. Shipley, Jr.
- 申请人地址： MA Marlborough
- 专利权人： Shipley Company Inc.
- 当前专利权人： Shipley Company Inc.
- 当前专利权人地址： MA Marlborough
- 主分类号： H05K3/00
- IPC分类号： H05K3/00 ; H05K3/18 ; H05K3/20 ; H05K3/46 ; G03G5/16
摘要：
The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques.
公开/授权文献
- US6138100A Interface for a voice-activated connection system 公开/授权日：2000-10-24
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