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公开(公告)号：US20010006759A1
公开(公告)日：2001-07-05
申请号：US09149318
申请日：1998-09-08
IPC分类号： G03F007/027 , G03F007/028 , G03F007/033 , G03F007/038 , G03F007/09 , G03F007/30 , G03F007/40 , C08J003/24 , B32B025/16 , B32B027/16
CPC分类号： H01L23/5329 , C09D163/08 , G03F7/0045 , G03F7/038 , H01L23/49894 , H01L2924/0002 , H05K3/287 , C08L2666/02 , H01L2924/00
摘要： Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The compositions of the invention are use to form flexible coatings having a dielectric constant of 3 or less. The compositions comprise a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspect of the invention, the compositions of the invention further comprise a crosslinking agent capable of solvating the remaining constituents of the composition. The coatings are used for the manufacture of electronic and other devices.
摘要翻译： 辐射敏感组合物，使用组合物的方法和包含该组合物的制品。 本发明的组合物用于形成介电常数为3或更小的柔性涂层。 组合物包含树脂粘合剂和包含一个或多个内部环氧基团的聚丁二烯。 在本发明的优选方面，本发明的组合物还包含能够溶解组合物的剩余组分的交联剂。 涂层用于制造电子和其他设备。
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公开(公告)号：US5334488A
公开(公告)日：1994-08-02
申请号：US59912
申请日：1993-05-10
CPC分类号： H05K3/205 , H05K3/465 , H05K3/4661 , H05K3/4682 , H05K2201/09563 , H05K2203/0565 , H05K2203/1407 , H05K3/0023 , H05K3/184
摘要： The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques.
摘要翻译： 本发明用于形成多层电路板，其中使用选择性电镀技术顺序地形成层，并且对介电材料进行成像以实现细线分辨率和电路之间的互连。 本发明允许使用成像技术顺序地形成更高密度的多层。
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公开(公告)号：US5246817A
公开(公告)日：1993-09-21
申请号：US462607
申请日：1990-01-09
CPC分类号： H05K3/465 , H05K3/205 , H05K3/4661 , H05K2201/09563 , H05K2203/0565 , H05K2203/1407 , H05K3/0023 , H05K3/184
摘要： The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques.
摘要翻译： 本发明用于形成多层电路板，其中使用选择性电镀技术顺序地形成层，并且对介电材料进行成像以实现细线分辨率和电路之间的互连。 本发明允许使用成像技术顺序地形成更高密度的多层。
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公开(公告)号：US4152164A
公开(公告)日：1979-05-01
申请号：US734486
申请日：1976-10-21
CPC分类号： C23C18/1617
摘要： This invention relates to electroless metal deposition and more specifically, to a process where a plating solution is brought to equilibrium and thereafter operated with the concentration of plating reactants and by-products maintained substantially constant. The plating solution treated in accordance with the invention is one having evaporative losses of at least one percent per plating cycle. Following the process, a plating solution can be operated indefinitely and yields a metal plate of uniform quality and predictable properties at any time during use of the solution. The invention avoids the known problems of by-product build-up and variable concentration of reactants typically associated with the use of such solutions.
摘要翻译： 本发明涉及无电金属沉积，更具体地说，涉及一种使电镀液达到平衡并随后以电镀反应物和副产物的浓度保持基本恒定的方式操作的方法。 根据本发明处理的电镀溶液是每个电镀循环具有至少1％的蒸发损失的镀液。 在该过程之后，可以无限期地操作电镀溶液，并且在使用溶液期间的任何时间产生均匀质量的金属板和可预测的性质。 本发明避免了通常与使用这种溶液相关的副产物积聚和反应物的可变浓度的已知问题。
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