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US5343615A Semiconductor device and a process for making same having improved leads 失效
半导体器件及其制造方法具有改进的引线

Semiconductor device and a process for making same having improved leads
摘要:
A process for producing a semiconductor device having a package with a semiconductor element molded therein, and a plurality of leads, each constituted by an inner lead located inside the package and an outer lead located outside the package, the leads being arranged in a line at a predetermined pitch, and the semiconductor element being electrically connected to the inner lead of each of the leads, wherein each side edge of each of the outer leads is flat.
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