发明授权
US5343615A Semiconductor device and a process for making same having improved leads
失效
半导体器件及其制造方法具有改进的引线
- 专利标题: Semiconductor device and a process for making same having improved leads
- 专利标题(中): 半导体器件及其制造方法具有改进的引线
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申请号: US853798申请日: 1992-03-19
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公开(公告)号: US5343615A公开(公告)日: 1994-09-06
- 发明人: Michio Sono , Akihiro Kubota , Junichi Kasai , Masanori Yoshimoto , Keiichi Masaki
- 申请人: Michio Sono , Akihiro Kubota , Junichi Kasai , Masanori Yoshimoto , Keiichi Masaki
- 申请人地址: JPX Kawasaki
- 专利权人: Fujitsu Limited
- 当前专利权人: Fujitsu Limited
- 当前专利权人地址: JPX Kawasaki
- 优先权: JPX3-059060 19910322
- 主分类号: H01L23/50
- IPC分类号: H01L23/50 ; H01L23/495 ; H01R43/00 ; B29B13/00
摘要:
A process for producing a semiconductor device having a package with a semiconductor element molded therein, and a plurality of leads, each constituted by an inner lead located inside the package and an outer lead located outside the package, the leads being arranged in a line at a predetermined pitch, and the semiconductor element being electrically connected to the inner lead of each of the leads, wherein each side edge of each of the outer leads is flat.
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