发明授权
- 专利标题： HDI impedance matched microwave circuit assembly
- 专利标题（中）： HDI阻抗匹配微波电路组件
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申请号： US869090申请日： 1992-04-14
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公开(公告)号： US5355102A公开(公告)日： 1994-10-11
- 发明人: William P. Kornrumpf , Robert J. Wojnarowski , Charles W. Eichelberger
- 申请人： William P. Kornrumpf , Robert J. Wojnarowski , Charles W. Eichelberger
- 申请人地址： NY Schenectady
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： NY Schenectady
- 主分类号： H01L23/64
- IPC分类号： H01L23/64 ; H03H7/38 ; H05K3/10 ; H05K3/30
摘要：
Active components of a microwave system are interconnected on a substrate by a dielectric-overlay, high-density-interconnect structure in a manner which provides close impedance matching, minimizes impedance discontinuities and substantially increases the yield of good circuits.
公开/授权文献
- US4172570A Landing gear in-flight vibration dampener 公开/授权日：1979-10-30
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