A positive type photosensitive resin composition contains (a) a quinone diazido phenolic resin represented by the formula: ##STR1## wherein R.sup.1 is an alkyl group having 1 to 4 carbon atoms, R.sup.2 is a bivalent hydrocarbon residue having 5 to 16 carbon atoms provided that groups bound to R.sup.2 do not bind with the same carbon atom of R.sup.2, D.sup.1, D.sup.2 and D.sup.3 and are the same or different groups and each represent a hydrogen atom or a quinone diazido unit represented by ##STR2## provided that a molar ratio of the hydrogen atom to the quinone diazido unit is 0 to 10, m is a number of 0 to 10, n is a number of 1 or 2, and l.sub.1, l.sub.2 and l.sub.3 are the same or different numbers and each represent a number of 1 to 3; and (b) an alkali-soluble resin.