Invention Grant
- Patent Title: Method for tackless packaging of hot melt adhesives
- Patent Title (中): 热熔胶粘剂无粘合包装方法
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Application No.: US993890Application Date: 1992-12-23
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Publication No.: US5373682APublication Date: 1994-12-20
- Inventor: Stephen Hatfield , Shelley Gore , David Fame , Anthony Rindone
- Applicant: Stephen Hatfield , Shelley Gore , David Fame , Anthony Rindone
- Applicant Address: DE Wilmington
- Assignee: National Starch and Chemical Investment Holding Corporation
- Current Assignee: National Starch and Chemical Investment Holding Corporation
- Current Assignee Address: DE Wilmington
- Main IPC: B29B13/02
- IPC: B29B13/02 ; B65B63/08 ; B65B55/14
Abstract:
A non-blocking hot melt adhesive mass is packaged by directly pouring or pumping the molten adhesive into a cylindrical plastic tube, the cylindrical tube being in contact with a heat sink. The resultant adhesive package is provided in a readily handable cartridge form which may be produced in a continuous line operation.
Public/Granted literature
- US6002151A Non-volatile trench semiconductor device Public/Granted day:1999-12-14
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