发明授权
- 专利标题: Modular electronic circuit housing and wiring board
- 专利标题(中): 模块化电子电路外壳和接线板
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申请号: US954537申请日: 1992-09-29
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公开(公告)号: US5375040A公开(公告)日: 1994-12-20
- 发明人: David Cooper , Kaz Furmanczyk
- 申请人: David Cooper , Kaz Furmanczyk
- 申请人地址: WA Lynnwood
- 专利权人: Eldec Corporation
- 当前专利权人: Eldec Corporation
- 当前专利权人地址: WA Lynnwood
- 主分类号: H05K7/14
- IPC分类号: H05K7/14 ; H05K5/00
摘要:
A generally rectangular housing base or body portion has an upward-opening central cavity and mounting ears extending from each corner. A wiring board on which electronic circuit components are mounted is supported in the cavity of the base. Each end portion of the wiring board extends from the cavity between two of the mounting ears. The top of the cavity is closed by a lid to enclose the circuit components. The opposite ends of the wiring board projecting from the housing cavity are adapted for connection of different pin or stud terminal connectors so that the housing-board unit is capable of being easily joined to or arranged with other electrical parts or units.
公开/授权文献
- US4196609A Tube expander 公开/授权日:1980-04-08
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