发明授权
US5378662A Glass, dielectric composition, multilayer wiring substrate, and
multilayer ceramic capacitor
失效
玻璃，电介质组合物，多层布线基板和多层陶瓷电容器
- 专利标题： Glass, dielectric composition, multilayer wiring substrate, and multilayer ceramic capacitor
- 专利标题（中）： 玻璃，电介质组合物，多层布线基板和多层陶瓷电容器
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申请号： US83527申请日： 1993-06-30
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公开(公告)号： US5378662A公开(公告)日： 1995-01-03
- 发明人: Hiroshi Tsuyuki
- 申请人： Hiroshi Tsuyuki
- 申请人地址： JPX Tokyo
- 专利权人： TDK Corporation
- 当前专利权人： TDK Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX4-196289 19920630
- 主分类号： C03C4/16
- IPC分类号： C03C4/16 ; C03C3/068 ; C03C3/095 ; C03C3/15 ; C03C3/253 ; C03C14/00 ; C04B35/00 ; H01B3/08 ; H01G4/08 ; H01G4/12 ; H01G4/30 ; H05K1/00 ; H05K1/03 ; H05K1/16 ; H05K3/46 ; C03C8/14
摘要：
A glass comprising 10-40 mol % as Ln.sub.2 O.sub.3 of a lanthanide oxide wherein Ln is a lanthanide element, 30-60 mol % as SiO.sub.2, B.sub.2 O.sub.3 and GeO.sub.2 in total of silicon dioxide, boron oxide and/or germanium oxide, and 16-40 mol % as Al.sub.2 O.sub.3 of aluminum oxide has high Tg, a low average coefficient of linear expansion and a high dielectric constant. A dielectric composition containing the glass and a dielectric material is useful in the fabrication of multilayer wiring substrates and multilayer ceramic capacitors.
公开/授权文献
- USD414399S Wire bundle support 公开/授权日：1999-09-28
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