发明授权
- 专利标题： Lead-on chip semiconductor device having peripheral bond pads
- 专利标题（中）： 具有外围接合焊盘的引线式芯片半导体器件
-
申请号： US107412申请日： 1993-08-16
-
公开(公告)号： US5381036A公开(公告)日： 1995-01-10
- 发明人: Charles G. Bigler , James J. Casto , Michael B. McShane , David D. Afshar
- 申请人： Charles G. Bigler , James J. Casto , Michael B. McShane , David D. Afshar
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; H01L21/60 ; H01L23/495 ; H01L23/50 ; H01L23/544 ; H01L23/48 ; H01L29/44 ; H01L29/52 ; H01L29/60
摘要：
A semiconductor device (10) has a lead-on-chip (LOC) configuration. Leads (24) of the device have central portions (36) which are electrically coupled to peripheral bond pads (14) by conductive wires (30). Inner portions (38) of the leads extend from the central portions toward centerline A--A for improved adhesion and to provide an internal clamping area (41) which stabilizes the leads during wire bonding. In one embodiment, tie bar (22) of leadframe (16) is used to distribute power across semiconductor chip (12). The leadframe may also include chip alignment features (50) and tape alignment features (52) to align chip (12) and insulating tape (18) to the leadframe, respectively.
公开/授权文献
- US4350337A Energy saving arrangement for bowling apparatus 公开/授权日：1982-09-21
信息查询
IPC分类:
