发明授权
- 专利标题： Process for producing copper clad laminate
- 专利标题（中）： 生产覆铜层压板的工艺
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申请号： US950757申请日： 1992-09-24
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公开(公告)号： US5382333A公开(公告)日： 1995-01-17
- 发明人: Kazuhiro Ando , Takamasa Kawakami , Yasuhiro Shouji , Yasuo Tanaka , Takeo Kanaoka , Norio Sayama
- 申请人： Kazuhiro Ando , Takamasa Kawakami , Yasuhiro Shouji , Yasuo Tanaka , Takeo Kanaoka , Norio Sayama
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Gas Chemical Company, Inc.
- 当前专利权人： Mitsubishi Gas Chemical Company, Inc.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-199211 19900730
- 主分类号： C23C22/63
- IPC分类号： C23C22/63 ; C23C22/83 ; H05K3/38 ; H05K3/46 ; C25F5/00
摘要：
A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.
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