发明授权
- 专利标题： Integrated circuit substrate with cooling accelerator substrate
- 专利标题（中）： 具有冷却加速器基板的集成电路基板
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申请号： US168762申请日： 1993-12-16
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公开(公告)号： US5403783A公开(公告)日： 1995-04-04
- 发明人: Keiichiro Nakanishi , Tsuneyo Chiba , Hiroyuki Itoh , Tatsuya Saitoh , Takeshi Kato
- 申请人： Keiichiro Nakanishi , Tsuneyo Chiba , Hiroyuki Itoh , Tatsuya Saitoh , Takeshi Kato
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX4-347811 19921228
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/427 ; H01L23/433 ; H01L23/473 ; H01L21/60
摘要：
An electronic device includes an integrated circuit device, the integrated circuit device comprises a first substrate including an integrated electronic semiconductor circuit and a second substrate including a cooling accelerator for accelerating a heat energy exchange between the integrated electronic semiconductor circuit and a cooling fluid, and the second substrate is joined fixedly with the first substrate through a covalent bond formed between the first substrate and the second substrate.
公开/授权文献
- US6055821A Purge system for an absorption air conditioner 公开/授权日：2000-05-02