公开(公告)号：US5403783A

公开(公告)日：1995-04-04

申请号：US168762

申请日：1993-12-16

申请人： Keiichiro Nakanishi ,  Tsuneyo Chiba ,  Hiroyuki Itoh ,  Tatsuya Saitoh ,  Takeshi Kato

发明人： Keiichiro Nakanishi ,  Tsuneyo Chiba ,  Hiroyuki Itoh ,  Tatsuya Saitoh ,  Takeshi Kato

IPC分类号： H01L21/48 ,  H01L23/427 ,  H01L23/433 ,  H01L23/473 ,  H01L21/60

CPC分类号： H01L24/83 ,  H01L21/4871 ,  H01L23/427 ,  H01L23/433 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/83894 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152

摘要： An electronic device includes an integrated circuit device, the integrated circuit device comprises a first substrate including an integrated electronic semiconductor circuit and a second substrate including a cooling accelerator for accelerating a heat energy exchange between the integrated electronic semiconductor circuit and a cooling fluid, and the second substrate is joined fixedly with the first substrate through a covalent bond formed between the first substrate and the second substrate.

摘要翻译： 电子设备包括集成电路器件，该集成电路器件包括包括集成电子半导体电路的第一衬底和包括用于加速集成电子半导体电路和冷却流体之间的热能交换的冷却加速器的第二衬底， 第二基板通过在第一基板和第二基板之间形成的共价键与第一基板固定连接。