发明授权
US5407872A Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material 失效
玻璃纤维形成组合物,由组合物获得的玻璃纤维和用于电路板的基板,包括玻璃纤维作为增强材料

Glass fiber forming composition, glass fibers obtained from the
composition and substrate for circuit board including the glass fibers
as reinforcing material
摘要:
A glass fiber forming composition exhibits a remarkably high dielectric constant .epsilon..sub..GAMMA. as well as superior chemical resistance, yet it is readily spun into glass fibers. The composition is characterized to show a devitrification temperature which is lower than a spinning temperature at which the glass composition exhibits a viscosity of 10.sup.2.5 poise, so as to be readily spun into corresponding glass fibers. The composition consists essentially of 40 to 65 mol % of SiO.sub.2 ; 20 to 45 mol % of at least one component selected from the group consisting of MgO, CaO, SrO and BaO; 5 to 25 mol % of at least one component selected from the group consisting of TiO.sub.2 and ZrO.sub.2 ; and 0.5 to 15 mol % of NbO.sub.5/2 as calculated from an incorporated amount of Nb.sub.2 O.sub.5. Alternately, the composition consist essentially of 40 to 65 mol % of SiO.sub.2 ; 20 to 45 mol % of at least one component selected from the group consisting of CaO, SrO and BaO; 5 to 25 mol % of at least one component selected from the group consisting of TiO.sub.2 and ZrO.sub.2 ; 0.5 to 15 mol % of NbO.sub.5/2 as calculated from an incorporated amount of Nb.sub.2 O.sub.5 ; and 0.5 to 15 mol % of AlO.sub.3/2 as calculated from an incorporated amount of Al.sub.2 O.sub.3. The composition is also characterized to incorporate at least 85 mol % of a total amount of the oxides and have a dielectric constant [.epsilon..sub..GAMMA. ] of 9 or more at 1 MHz and 25.degree. C.
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