发明授权
- 专利标题: Bonded magnet moulding compositions
- 专利标题(中): 粘结磁体成型组合物
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申请号: US151305申请日: 1993-11-12
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公开(公告)号: US5409624A公开(公告)日: 1995-04-25
- 发明人: Ryoji Watanabe
- 申请人: Ryoji Watanabe
- 申请人地址: JPX Ibaraki
- 专利权人: ICI Japan Limited
- 当前专利权人: ICI Japan Limited
- 当前专利权人地址: JPX Ibaraki
- 主分类号: H01F1/057
- IPC分类号: H01F1/057 ; H01F1/08 ; H01F1/147
摘要:
Compositions for making a bonded magnet product by conventional moulding techniques comprising high amounts of magnetic particles together with a polyamide resin and from about 0.2 to 3% by weight of a hindered phenol hydrazine compound are described.
公开/授权文献
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