A projection exposure method and apparatus are disclosed, which can perform a focusing operation with respect to a partly omitted shot exposed at a peripheral portion of a photosensitive substrate such as a wafer. In the projection exposure method and apparatus, when a prohibition band having a predetermined width is set from the edge of the substrate, and exposure is to be performed with respect to a shot area having a portion located only within the prohibition band and the remaining portion located outside the edge of the substrate, a focus detection point is shifted to the boundary line of the prohibition band on the substrate, and a focusing operation is performed. Thereafter, the focus detection point is moved to an original target shot exposure position to perform exposure.