发明授权
- 专利标题： Lid for semiconductor package and package having the lid
- 专利标题（中）： 用于具有盖子的半导体封装和封装
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申请号： US301186申请日： 1994-09-06
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公开(公告)号： US5414300A公开(公告)日： 1995-05-09
- 发明人: Yoji Tozawa , Shizuki Hashimoto , Tetsuya Yamamoto
- 申请人： Yoji Tozawa , Shizuki Hashimoto , Tetsuya Yamamoto
- 申请人地址： JPX Yamaguchi
- 专利权人： Sumitomo Metal Ceramics Inc.
- 当前专利权人： Sumitomo Metal Ceramics Inc.
- 当前专利权人地址： JPX Yamaguchi
- 优先权： JPX5-345754 19931210; JPX6-126724 19940428
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/02 ; H01L23/04 ; H01L23/10 ; H01L21/00
摘要：
In a ceramic lid for sealing a semiconductor device mount portion of a ceramic package substrate having a semiconductor device mounted thereon, a seal layer disposed in an outer peripheral edge portion of a lid is formed by a solder comprising 2 to 15 wt % of Bi, 2.0 to 6.0 wt % of Sn, 0.5 to 2.0 wt % of In, 0.5 to 2.0 wt % of Ag and the balance of Pb, through an Ag--Pt system underlying metallized layer. A semiconductor package comprising a semiconductor package substrate and a lid is sealed by the lid.
公开/授权文献
- US4983801A Rail tensioning apparatus 公开/授权日：1991-01-08
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