发明授权
- 专利标题： Method and apparatus for applying solder flux to a printed circuit
- 专利标题（中）： 将焊剂施加到印刷电路的方法和装置
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申请号： US287361申请日： 1994-08-08
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公开(公告)号： US5415337A公开(公告)日： 1995-05-16
- 发明人: Patrick T. Hogan , Richard G. Christyson
- 申请人： Patrick T. Hogan , Richard G. Christyson
- 申请人地址： OH Westlake
- 专利权人： Nordson Corporation
- 当前专利权人： Nordson Corporation
- 当前专利权人地址： OH Westlake
- 主分类号： B23K3/00
- IPC分类号： B23K3/00 ; B05B12/06 ; B05B12/12 ; B05B15/68 ; B23K1/20 ; H05K3/34 ; B05B15/00 ; B05B15/02
摘要：
Apparatus and methods for a system and process for applying a flux coating to a circuit board by pulsing an airless spray gun on and off to achieve excellent circuit board through-hole penetration and uniform film thickness. An overspray collection system is provided which reduces overspray and increases material utilization and transfer efficiency. A gun positioning mechanism, which can be automated, accurately locates the gun relative to the circuit board.
公开/授权文献
- US6071687A Photothermographic element 公开/授权日：2000-06-06
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