发明授权
- 专利标题： Cicuit and process of manufacturing the circuit
- 专利标题（中）： 电路的制造和制造过程
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申请号： US33326申请日： 1993-03-18
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公开(公告)号： US5416277A公开(公告)日： 1995-05-16
- 发明人: Herbert Zimmermann , Klaus Steinle , Kurt Spitzenberger , Guenther Stecher
- 申请人： Herbert Zimmermann , Klaus Steinle , Kurt Spitzenberger , Guenther Stecher
- 申请人地址： DEX Stuttgart
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 当前专利权人地址： DEX Stuttgart
- 优先权： DEX4030055.2 19900922
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/538 ; H05K1/03 ; H05K1/09 ; H05K3/32 ; H05K3/40 ; H05K3/46 ; B22F7/02
摘要：
In a process for manufacturing a circuit including a first circuit plane of a ceramic substrate which is covered with, for example, thick-film structures and is imprinted with corresponding conductor paths having contact faces, the ceramic substrate is to be connected with a second circuit plane composed of a green tape substrate.
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