A multiconductor and support has a plurality of elongate conductive elements each with a pair of termini. An elongate support means, carrying adjacent conductive elements, has openings located at the distal and the proximal ends for alignment with conductive elements extending thereover leaving the distal termini thereof unsupported. Heat activated adhesive on the support means bonds the conductive elements. Each of the conductive elements are spaced from the other conductive elements and have center lines which are parallel. A machine for assembly of a multiconductor and support means has a plurality of spools supplying conductive elements and a plurality of guides each positioned to receive and align the supplied conductive elements. The guides position the conductive elements spaced from and parallel to each other. A supply of support means moves support means intermittently but synchronously between the conductive elements and a flat surface. A heated platten compresses and bonds the conductive elements and the support means into an pair. A method for assembling a multiconductor and support includes intermittently moving several conductive elements in parallel spaced relation and intermittently moving a support means in a plane parallel to the conductive elements. Pressing the parallel conductive elements and the support means together forms the pair.