发明授权
- 专利标题： Method of inspecting image sensors
- 专利标题（中）： 检查图像传感器的方法
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申请号： US939090申请日： 1992-09-02
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公开(公告)号： US5426060A公开(公告)日： 1995-06-20
- 发明人: Yukito Kawahara , Satoshi Machida , Hiroshi Mukainakano , Masahiro Yokomichi , Masato Higashi
- 申请人： Yukito Kawahara , Satoshi Machida , Hiroshi Mukainakano , Masahiro Yokomichi , Masato Higashi
- 申请人地址： JPX
- 专利权人： Seiko Instruments Inc.
- 当前专利权人： Seiko Instruments Inc.
- 当前专利权人地址： JPX
- 优先权： JPX2-273527 19901012; JPX2-321839 19901126
- 主分类号： H01L27/146
- IPC分类号： H01L27/146 ; H04N1/03 ; H01L21/66
摘要：
A method of inspecting and a method of manufacturing image sensors formed on a surface of a semiconductor wafer. A semiconductor wafer is provided having image sensors formed on its surface. Grooves are cut at boundaries between image sensors to be inspected, so that each groove has a depth that is smaller than the thickness of the semiconductor wafer. The grooves are cut in the boundaries between the image sensors so that photoN sensing carriers generated in the boundary regions, that are not generated by the image sensor being inspected, do not affect the inspection of the image sensor. The characteristics of the image sensors are inspected before cutting through the semiconductor wafer to form individual image sensors. Thus, in accordance with the present invention, the electrical characteristics of the image sensors can be accurately ascertained either before or after separation from the semiconductor wafer.
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