发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US122663申请日: 1993-09-17
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公开(公告)号: US5430317A公开(公告)日: 1995-07-04
- 发明人: Takahiro Onai , Katsuyoshi Washio , Tohru Nakamura
- 申请人: Takahiro Onai , Katsuyoshi Washio , Tohru Nakamura
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX4-247524 19920917
- 主分类号: H01L21/331
- IPC分类号: H01L21/331 ; H01L29/73 ; H01L29/732 ; H01L27/01 ; H01L27/12
摘要:
A transistor is formed on a bonded SOI substrate. A collector electrode is connected to the peripheral sides of the collector areas on the insulator. A first insulator of isolation is formed on the peripheral side of the collector electrode. A base electrode is connected to a base area on the first insulator of isolation. Second insulators of isolation are formed on the peripheral side of a base electrode, and emitter electrode is connected to an emitter area by the second insulators of isolation. The connections between the collector electrode and the collector areas, between the base electrode and the base area, and between the emitter electrode and the emitter area are made under the emitter electrode, so the occupation area is small.
公开/授权文献
- US6073370A Snowboard boot power lacing configuration 公开/授权日:2000-06-13
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