A wafer processor including a wafer support for holding semiconductor wafers. The wafer support member includes wafer gripping fingers mounted in receptacles formed through a wafer support plate. The fingers are angularly displaced to spread the fingers and allow loading of wafers therebetween. The fingers have central cores which are flexibly mounted within a mounting flange by a thin diaphragm. A pivot control supports the cores and carries axial loading. The pivot control members preferably are U-shaped and can serve as connections to an actuator. A locking mechanism is also shown to secure the actuator connection.