公开(公告)号：US5431421A

公开(公告)日：1995-07-11

申请号：US855767

申请日：1992-03-18

申请人： Raymon F. Thompson ,  Timothy J. Reardon ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Timothy J. Reardon ,  Aleksander Owczarz

IPC分类号： G11B7/26 ,  H01L21/00 ,  H01L21/687 ,  B23B31/32 ,  F23M9/10

CPC分类号： H01L21/68728 ,  H01L21/67023 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  G11B7/26 ,  Y10T279/31

摘要： A wafer processor including a wafer support for holding semiconductor wafers. The wafer support member includes wafer gripping fingers mounted in receptacles formed through a wafer support plate. The fingers are angularly displaced to spread the fingers and allow loading of wafers therebetween. The fingers have central cores which are flexibly mounted within a mounting flange by a thin diaphragm. A pivot control supports the cores and carries axial loading. The pivot control members preferably are U-shaped and can serve as connections to an actuator. A locking mechanism is also shown to secure the actuator connection.

摘要翻译： 一种晶片处理器，包括用于保持半导体晶片的晶片支架。 晶片支撑构件包括安装在通过晶片支撑板形成的插座中的晶片夹持指状物。 手指有角度位移以扩展指状物并允许在其间装载晶片。 手指具有中心芯，其通过薄隔膜灵活地安装在安装凸缘内。 枢轴控制支撑轴芯并承载轴向载荷。 枢轴控制构件优选为U形，并且可用作与致动器的连接。 还示出了锁定机构以固定致动器连接。

公开(公告)号：US5377708A

公开(公告)日：1995-01-03

申请号：US53524

申请日：1993-04-26

申请人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

发明人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B01F3/08 ,  F04B9/105 ,  F04B43/08 ,  G11B7/26 ,  H01L21/00 ,  H01L21/687 ,  B08B3/10

CPC分类号： H01L21/68728 ,  B01F3/088 ,  F04B43/08 ,  F04B9/105 ,  H01L21/67023 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  G11B7/26 ,  Y10S134/902

摘要： Disclosed are apparatuses and methods for improved processing of semiconductor wafers and the like using vapor phase processing chemicals, particularly aqueous hydrofluoric acid etchants. Homogeneous vapor mixtures are generated from homogeneous liquid mixtures. Means for recirculating, mixing and agitating the liquid phase reactants are provided. In some embodiments the liquid phase is advantageously circulated through a chemical trench within the processing bowl. Exposure of wafers to vapors from the chemical trench can be controlled by a vapor control valve which is advantageously the bottom of the processing chamber. The wafer is rotated or otherwise moved within the processing chamber to provide uniform dispersion of the homogeneous reactant vapors across the wafer surface and to facilitate vapor circulation to the processed surface. A radiative volatilization processor can be utilized to volatilize reaction by-products which form under some conditions. The apparatuses provide efficient uniform etching with low particle count performance.

摘要翻译： 公开了使用气相处理化学品，特别是氢氟酸蚀刻剂改进半导体晶片等的处理的装置和方法。 均相蒸气混合物由均匀的液体混合物产生。 提供了用于液相反应物的再循环，混合和搅拌的方法。 在一些实施方案中，液相有利地循环通过加工碗内的化学沟槽。 可以通过蒸气控制阀来控制晶片从化学沟槽向蒸气的曝光，该蒸汽控制阀有利地是处理室的底部。 晶片在处理室内旋转或以其它方式移动，以提供均匀反应物蒸汽在晶片表面上的均匀分散，并促进蒸气循环到经处理的表面。 辐射挥发处理器可用于挥发在一些条件下形成的反应副产物。 这些装置提供了具有低粒度计数性能的有效的均匀蚀刻。

公开(公告)号：US5357991A

公开(公告)日：1994-10-25

申请号：US53523

申请日：1993-04-26

申请人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

发明人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B01F3/08 ,  F04B9/105 ,  F04B43/08 ,  G11B7/26 ,  H01L21/00 ,  H01L21/687 ,  B08B3/10

CPC分类号： B01F3/088 ,  F04B43/08 ,  F04B9/105 ,  H01L21/67023 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68728 ,  H01L21/68785 ,  G11B7/26 ,  Y10S134/902

摘要： Disclosed are apparatuses and methods for improved processing of semiconductor wafers and the like using vapor phase processing chemicals, particularly aqueous hydrofluoric acid etchants. Homogeneous vapor mixtures are generated from homogeneous liquid mixtures. Means for recirculating, mixing and agitating the liquid phase reactants are provided. In some embodiments the liquid phase is advantageously circulated through a chemical trench within the processing bowl. Exposure of wafers to vapors from the chemical trench can be controlled by a vapor control valve which is advantageously the bottom of the processing chamber. The wafer is rotated or otherwise moved within the processing chamber to provide uniform dispersion of the homogeneous reactant vapors across the wafer surface and to facilitate vapor circulation to the processed surface. A radiative volatilization processor can be utilized to volatilize reaction by-products which form under some conditions. The apparatuses provide efficient uniform etching with low particle count performance.

摘要翻译： 公开了使用气相处理化学品，特别是氢氟酸蚀刻剂改进半导体晶片等的处理的装置和方法。 均相蒸气混合物由均匀的液体混合物产生。 提供了用于液相反应物的再循环，混合和搅拌的方法。 在一些实施方案中，液相有利地循环通过加工碗内的化学沟槽。 可以通过蒸气控制阀来控制晶片从化学沟槽向蒸气的曝光，该蒸汽控制阀有利地是处理室的底部。 晶片在处理室内旋转或以其它方式移动，以提供均匀反应物蒸汽在晶片表面上的均匀分散，并促进蒸气循环到经处理的表面。 辐射挥发处理器可用于挥发在一些条件下形成的反应副产物。 这些装置提供了具有低粒度计数性能的有效的均匀蚀刻。

公开(公告)号：US5235995A

公开(公告)日：1993-08-17

申请号：US665942

申请日：1991-03-06

申请人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

发明人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B01F3/08 ,  F04B9/105 ,  F04B43/08 ,  G11B7/26 ,  H01L21/00 ,  H01L21/687

CPC分类号： H01L21/68728 ,  B01F3/088 ,  F04B43/08 ,  F04B9/105 ,  H01L21/67023 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  G11B7/26 ,  Y10S134/902

摘要： Disclosed are apparatuses and methods for improved processing of semiconductor wafers and the using vapor phase processing chemicals, particularly aqueous hydrofluoric acid etchants. Homogeneous vapor mixtures are generated from homogeneous liquid mixtures. Means for recirculating, mixing and agitating the liquid phase reactants are provided. In some embodiments the liquid phase is advantageously circulated through a chemical trench within the processing bowl. Exposure of wafers to vapors from the chemical trench can be controlled by a vapor control valve which is advantageously the bottom of the processing chamber. The wafer is rotated or otherwise moved within the processing chamber to provide uniform dispersion of the homogeneous reactant vapors across the wafer surface and to facilitate vapor circulation to the processed surface. A radiative volatilization processor can be utilized to volatilize reaction by-products which form under some conditions. The apparatuses provide efficient uniform etching with low particle count performance.

摘要翻译： 公开了用于改进半导体晶片处理和使用气相处理化学品，特别是氢氟酸蚀刻剂的设备和方法。 均相蒸气混合物由均匀的液体混合物产生。 提供了用于液相反应物的再循环，混合和搅拌的方法。 在一些实施方案中，液相有利地循环通过加工碗内的化学沟槽。 可以通过蒸气控制阀来控制晶片从化学沟槽向蒸气的曝光，该蒸汽控制阀有利地是处理室的底部。 晶片在处理室内旋转或以其它方式移动，以提供均匀反应物蒸汽在晶片表面上的均匀分散，并促进蒸气循环到经处理的表面。 辐射挥发处理器可用于挥发在一些条件下形成的反应副产物。 这些装置提供了具有低粒度计数性能的有效的均匀蚀刻。

公开(公告)号：US07138016B2

公开(公告)日：2006-11-21

申请号：US09893315

申请日：2001-06-26

申请人： Timothy J. Reardon ,  Thomas H. Oberlitner ,  Craig P. Meuchel ,  Aleksander Owczarz ,  Raymon F. Thompson

发明人： Timothy J. Reardon ,  Thomas H. Oberlitner ,  Craig P. Meuchel ,  Aleksander Owczarz ,  Raymon F. Thompson

IPC分类号： B05C11/00 ,  B05B12/00 ,  B05B15/00

CPC分类号： H01L21/6715 ,  G11B7/26 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  Y10S134/902

摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

公开(公告)号：US07094291B2

公开(公告)日：2006-08-22

申请号：US09893316

申请日：2001-06-26

申请人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner ,  Aleksander Owczarz ,  Raymon F. Thompson

发明人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner ,  Aleksander Owczarz ,  Raymon F. Thompson

IPC分类号： B05C11/00 ,  B05B12/00 ,  B05B15/00

CPC分类号： H01L21/6715 ,  G11B7/26 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  Y10S134/902

摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

公开(公告)号：US5445172A

公开(公告)日：1995-08-29

申请号：US27863

申请日：1993-03-08

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： G11B7/26 ,  H01L21/00 ,  H01L21/687 ,  B08D3/02

CPC分类号： H01L21/68728 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  G11B7/26 ,  Y10S134/902

摘要： A single wafer processing apparatus includes a portable processing head that can be a portable module or a movable unit mounted to a supporting machine frame. The processing head has movable fingers adapted to grip a wafer. The fingers protrude from a protective wafer plate. Indexing and rotation monitoring assemblies are provided for automation of the wafer processing steps. A complementary processing base includes an upwardly-open bowl that receives a wafer held by the portable processing head. It has a full-diameter movable bottom wall for rapid draining purposes. Liquid and/or gas jets and nozzles supply fluids required within the bowl for processing of wafers.

摘要翻译： 单个晶片处理装置包括便携式处理头，其可以是安装到支撑机架的便携式模块或可移动单元。 处理头具有适于夹紧晶片的活动指状物。 指状物从保护性晶片板突出。 提供分度和旋转监测组件用于晶片处理步骤的自动化。 补充处理基座包括接收由便携式处理头保持的晶片的向上开口的碗。 它具有用于快速排水的全直径可移动底壁。 液体和/或气体喷嘴和喷嘴提供碗内所需的流体用于处理晶片。

公开(公告)号：US5232328A

公开(公告)日：1993-08-03

申请号：US665766

申请日：1991-03-05

申请人： Aleksander Owczarz ,  Raymon F. Thompson

发明人： Aleksander Owczarz ,  Raymon F. Thompson

IPC分类号： H01L21/00

CPC分类号： H01L21/67028 ,  Y10S414/14

摘要： A processor for centrifugal processing of semiconductor wafers and similar units. The processor is specially constructed to provide an automatically extendible and retractable rotor head to allow automated loading and unloading of wafers. The processor includes a novel shaft assembly construction which includes an axially extendible shaft controlled using pressurized fluid. The pressurized fluid is supplied to the shaft assembly by a pressure supply which is controllably extendable and retractable for engagement with the shaft assembly when rotation is stopped. The shaft assembly also preferably incorporates an axial locking mechanism which holds the axially movable components of the shaft assembly in fixed axial position during rotation, while allowing release when rotation is stopped so that movable portions of the shaft assembly can be axially extended.

摘要翻译： 用于半导体晶片和类似单元的离心处理的处理器。 处理器是特别构造的，以提供可自动伸缩的转子头，以允许自动装载和卸载晶片。 该处理器包括新颖的轴组件结构，其包括使用加压流体控制的可轴向延伸的轴。 加压流体通过压力供应器供应到轴组件，该压力供应器可旋转地延伸和缩回以用于与轴组件接合。 轴组件还优选地包括轴向锁定机构，其将轴组件的可轴向移动的部件在旋转期间保持在固定的轴向位置，同时当旋转停止时允许释放，使得轴组件的可动部分可以轴向延伸。

公开(公告)号：US6105592A

公开(公告)日：2000-08-22

申请号：US897913

申请日：1997-07-21

申请人： Raymon F. Thompson ,  Aleksander Owczarz ,  Daniel P. Bexten

发明人： Raymon F. Thompson ,  Aleksander Owczarz ,  Daniel P. Bexten

IPC分类号： H01L21/00 ,  B08B15/02

CPC分类号： H01L21/67034 ,  Y10S134/902

摘要： An apparatus for processing a semiconductor wafer is set forth. The apparatus comprises a processing bowl that defines a processing chamber. The bowl has an opening through which wafers may be placed in the apparatus. A wafer support structure adapted to support at least one wafer is mounted for rotation within the processing chamber. A motor drive assembly is connected to rotate the wafer support structure. At least one fluid nozzle accepts processing fluid and sprays the processing fluid on the one or more wafers carried by the wafer support structure. A door is used to seal the opening of the processing bowl. The door has an opening that is open to ambient atmosphere to facilitate passage of ambient gas into the processing chamber. An ambient gas intake assembly is disposed in the door. The ambient gas intake assembly comprises a high efficiency filter, preferably, and ULPA filter, disposed to filter ambient gas passing from the opening of the door to the processing chamber and a heater disposed to heat the filtered gas prior to entering the processing chamber.

摘要翻译： 阐述了一种用于处理半导体晶片的设备。 该装置包括限定处理室的处理碗。 碗具有开口，晶片可以通过该开口放置在装置中。 适于支撑至少一个晶片的晶片支撑结构被安装用于在处理室内旋转。 电动机驱动组件被连接以旋转晶片支撑结构。 至少一个流体喷嘴接受处理流体并将处理流体喷射在由晶片支撑结构承载的一个或多个晶片上。 门用于密封加工碗的开口。 门具有通向大气环境的开口，以便于环境气体进入处理室。 环境气体进入组件设置在门中。 环境气体进入组件包括优选的高效过滤器和ULPA过滤器，其设置成过滤从门的开口到处理室的环境气体，以及设置成在进入处理室之前加热经过滤的气体的加热器。

公开(公告)号：US5738128A

公开(公告)日：1998-04-14

申请号：US727271

申请日：1996-10-08

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B08B3/02 ,  H01L21/00 ,  H01L21/304

CPC分类号： H01L21/67017 ,  B08B3/02 ,  H01L21/67028 ,  H01L21/67034 ,  Y10S134/902

摘要： Apparatus (20) for cleaning carriers used to hold semiconductor wafers, substrates, data disks, flat panel displays and similar containers used in applications highly sensitive to contamination. The apparatus has a processing bowl (21) with entrance and exit ports (34, 36) through which carriers are installed and removed from processing chamber (21). Rotor (70) rotates within the processing chamber. Rotor (70) includes a rotor cage (71) which mounts detachable wafer carrier supports (214). Filtered, heated air is passed through the process chamber for drying. Cleaning liquid and additional drying gas can be supplied through manifolds (120, 110) positioned inside and outside rotor cage (71).

摘要翻译： 用于清洁用于保存半导体晶片，基板，数据盘，平板显示器和用于对污染高度敏感的应用中的类似容器的载体的装置（20）。 该装置具有一个具有入口和出口（34,36）的处理碗（21），载物从该处理室中被安装并从处理室（21）中移出。 转子（70）在处理室内旋转。 转子（70）包括安装可拆卸晶片载体支撑件（214）的转子笼（71）。 过滤的加热空气通过处理室进行干燥。 可以通过位于转子笼（71）内部和外部的歧管（120,110）供应清洁液体和附加的干燥气体。