Invention Grant
- Patent Title: Method and apparatus for heat treating
- Patent Title (中): 热处理方法和装置
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Application No.: US166014Application Date: 1993-12-14
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Publication No.: US5431561APublication Date: 1995-07-11
- Inventor: Kikuo Yamabe , Keitaro Imai , Katsuya Okumura , Ken Nakao , Seikou Ueno
- Applicant: Kikuo Yamabe , Keitaro Imai , Katsuya Okumura , Ken Nakao , Seikou Ueno
- Applicant Address: JPX Kawasaki JPX Kanagawa
- Assignee: Kabushiki Kaisha Toshiba,Tokyo Electron Sagami Limited
- Current Assignee: Kabushiki Kaisha Toshiba,Tokyo Electron Sagami Limited
- Current Assignee Address: JPX Kawasaki JPX Kanagawa
- Priority: JPX2-340622 19901130; JPX3-292725 19911108
- Main IPC: H01L21/324
- IPC: H01L21/324 ; C30B31/12 ; C30B31/14 ; H01L21/22 ; H01L21/31 ; H01L21/673 ; H01L21/683 ; F27D5/00
Abstract:
A method and an apparatus for heat treating in a heat treating apparatus having a heating chamber to be introduced with predetermined gas, a heater disposed around the heating chamber, and jigs disposed in the heating chamber for supporting wafers of a plurality of substrates to be treated in parallel with each other, wherein in order to make the temperature distribution of the wafers of the substrates to be treated in the radial direction uniform in the heat treatment, the jigs are formed to determine the sizes and the shape thereof in predetermined ranges having a gradient according to the heat treating method having a predetermined shape determining procedure so that the jigs are formed in ring-shaped trays (i.e. support-ring) for holding at the peripheries the substrates to be treated and the thickness of the tray is constant or such that the outer peripheral side thereof is thicker than the inner peripheral side thereof.
Public/Granted literature
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