发明授权
- 专利标题： Reworkable high density interconnect structure incorporating a release layer
- 专利标题（中）： 结合释放层的可重构的高密度互连结构
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申请号： US225876申请日： 1994-04-11
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公开(公告)号： US5434751A公开(公告)日： 1995-07-18
- 发明人: Herbert S. Cole, Jr. , Theresa A. Sitnik-Nieters , Robert J. Wojnarowski , John H. Lupinski
- 申请人： Herbert S. Cole, Jr. , Theresa A. Sitnik-Nieters , Robert J. Wojnarowski , John H. Lupinski
- 申请人地址： PA Philadelphia
- 专利权人： Martin Marietta Corporation
- 当前专利权人： Martin Marietta Corporation
- 当前专利权人地址： PA Philadelphia
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/538 ; H05K1/00 ; H05K1/11
摘要：
A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the chip pads; and a solvent-soluble release layer bonding the two portions together and allowing for easy removal of the HDI structure from the substrate of the module by immersion in an appropriate solvent for the release layer.
公开/授权文献
- US4388699A Bubble memory sense amplifier 公开/授权日：1983-06-14
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