-
1.发明授权
公开(公告)号：US5434751A
公开(公告)日：1995-07-18
申请号：US225876
申请日：1994-04-11
IPC分类号： H01L21/48 , H01L23/538 , H05K1/00 , H05K1/11
CPC分类号： H01L24/82 , H01L21/485 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L2224/04105 , H01L2224/2402 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L24/73 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H05K1/0286 , H05K3/4676 , Y10T29/49155
摘要： A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the chip pads; and a solvent-soluble release layer bonding the two portions together and allowing for easy removal of the HDI structure from the substrate of the module by immersion in an appropriate solvent for the release layer.
摘要翻译： 多芯片模块（包括高密度互连结构）具有：包含其中具有半导体芯片的衬底的第一部分，每个芯片具有接触焊盘; 第二部分包括互连芯片焊盘的（HDI）结构; 以及将两部分结合在一起的溶剂可溶性剥离层，并且通过浸渍在用于剥离层的合适溶剂中，可以容易地从模块的基材上除去HDI结构。
-
2.发明授权Method for making an electronics module having air bridge protection without large area ablation 失效制造具有空气桥保护而没有大面积消融的电子模块的方法
公开(公告)号：US5548099A
公开(公告)日：1996-08-20
申请号：US304920
申请日：1994-09-13
CPC分类号： H01L24/24 , H01L23/29 , H01L23/315 , H01L23/5389 , H01L23/66 , H01L24/82 , H01L2224/2402 , H01L2224/24227 , H01L2224/73267 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/3011 , Y10T29/4913
摘要： In a method for preserving an air bridge structure on an integrated circuit chip, without sacrificing metallization routing area in an overlying high density interconnect structure, a protective layer is sublimed over the air bridge to provide mechanical strength while preventing contamination and deformation during processing. A high density interconnect structure is applied over the chip and protective layer. A small portion of the high density interconnect structure is removed from the area over the air bridge structure, and the protective layer is then sublimed away, leaving the resultant structure with an undamaged air bridge which is free of residue.
摘要翻译： 在一种用于在集成电路芯片上保持空气桥结构的方法中，不牺牲上覆高密度互连结构中的金属化布线区域，保护层在空气桥上升华以提供机械强度，同时防止加工过程中的污染和变形。 在芯片和保护层上施加高密度互连结构。 将高密度互连结构的一小部分从空气桥结构上的区域去除，然后将保护层升华，留下所得结构与没有残留物的未损坏的空气桥。
-
公开(公告)号：US5534602A
公开(公告)日：1996-07-09
申请号：US47531
申请日：1993-04-19
CPC分类号： H01B3/306 , C08G73/1064 , C08L79/08
摘要： Polyetherimide compositions are provided having condensed bis (4-aminophenyl) sulfone units, diaminophenylindane units or a mixture thereof. These polyetherimides compositions have been found useful for making high temperature chip adhesives, laminating adhesives and film adhesives for high density interconnects in electronic circuitry.
摘要翻译： 提供具有缩合的双（4-氨基苯基）砜单元，二氨基苯基二茚基单元或其混合物的聚醚酰亚胺组合物。 已经发现这些聚醚酰亚胺组合物可用于制造用于电子电路中的高密度互连的高温芯片粘合剂，层压粘合剂和薄膜粘合剂。
-
4.发明授权Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing T.sub.G ' s 失效MUTLIPLE LAMINATION高密度互连过程和结构使用具有顺序降低的热塑性粘合剂
公开(公告)号：US5157589A
公开(公告)日：1992-10-20
申请号：US546963
申请日：1990-07-02
IPC分类号： H01L23/13 , H01L23/498 , H01L23/538 , H01L25/04 , H01L25/18 , H05K1/18 , H05K3/38 , H05K3/46
CPC分类号： H01L23/5389 , H01L23/13 , H01L23/49822 , H01L24/24 , H01L24/82 , H05K3/4635 , H05K3/4673 , H01L2224/2402 , H01L2224/24227 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01082 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H05K1/185 , H05K2201/0129 , H05K2201/0154 , H05K2201/0195 , H05K3/386 , H05K3/4644
摘要： A high density interconnect structure incorporating a plurality of laminated dieletric layers is fabricated using thermoplastic adhesive layers of progressively lower glass transition temperature in order to maintain the stability of the already fabricated structure during the addition of the later laminations. This structure also facilitates the removal of only a portion of the high density interconnect structure where a fault in the system can be corrected in one of the upper layers of the high density interconnect structure.
-
公开(公告)号：US4865873A
公开(公告)日：1989-09-12
申请号：US129854
申请日：1987-12-07
CPC分类号： H05K3/184 , C23C18/1605 , C23C18/1608 , C23C18/1831 , C23C18/1879 , C23C18/206 , C23C18/30 , C23C18/31 , H05K2203/0565 , H05K2203/0577 , H05K2203/107 , H05K2203/1415 , H05K3/0017 , Y10S430/165
摘要： A metal is electrolessly plated on a substrate which is first coated with at least one ablatively-removable layer that is selectively irradiated with laser radiation to obtain a pattern for the deposition of metal on the substrate. The electroless plating solution applied to the substrate after the irradiated substrate is coated with a catalyst also serves to remove the unirradiated portion of the ablatively-removable layer. The method is particularly suited for plating fine lines of metal, especially on non-planar surfaces.
摘要翻译： 将金属无电镀在基材上，该基材首先涂覆有至少一个可剥离层，其被选择性地用激光辐射照射以获得用于在基材上沉积金属的图案。 在经过照射的基板涂覆有催化剂之后施加到基板上的化学镀溶液也用于去除可消泡层的未照射部分。 该方法特别适用于镀金属细线，尤其适用于非平面表面。
-
公开(公告)号：US4354740A
公开(公告)日：1982-10-19
申请号：US152741
申请日：1980-05-23
申请人： Herbert S. Cole, Jr.
发明人： Herbert S. Cole, Jr.
IPC分类号： G02F1/13 , G02F1/1337
CPC分类号： G02F1/133719 , Y10S359/90
摘要： Homeotropic surface alignment is provided in liquid crystal display cells, utilizing high temperature peripheral sealing material, by fabricating the empty cell prior to introducing a solution of a homeotropic-aligning surfactant dissolved in a volatile solvent. The solvent is evaporated to provide a surfactant film on the cell cavity interior surfaces. The cell is then filled with the liquid crystal material and the cell is sealed.
摘要翻译： 在引入溶解在挥发性溶剂中的垂直取向表面活性剂的溶液之前，通过制造空容器，在液晶显示单元中提供使用高温周边密封材料的垂直表面对准。 蒸发溶剂以在电池腔内表面上提供表面活性剂膜。 然后用液晶材料填充电池，密封电池。
-
公开(公告)号：US4350603A
公开(公告)日：1982-09-21
申请号：US164254
申请日：1980-06-30
CPC分类号： C09B35/35 , C09K19/601
摘要： Novel tris-azo dye compositions and a liquid crystal composition containing the tris-azo dye compositions are disclosed. The tris-azo dye composition having terminal aromatic groups has the general formula: ##STR1## wherein R.sub.1 and R.sub.2 are various aromatic compounds including aromatic amines, substituted aromatic amines, hydroxy-substituted aromatic compounds and substituted hydroxy-containing aromatic compounds. When the tris-azo dichroic dyes are used as a guest dye in a host liquid crystal material, they form a novel liquid crystal composition for use in liquid crystal displays. Examples of R.sub.1 and R.sub.2 include organic radicals of aminoquinoline, tetrahydroquinoline, N-ethyl-1-naphthylamine and 1,8-diaminonaphthalene.
摘要翻译： 公开了新的三偶氮染料组合物和含有三偶氮染料组合物的液晶组合物。 具有末端芳族基团的三偶氮染料组合物具有以下通式：其中R1和R2是各种芳族化合物，包括芳族胺，取代的芳族胺，羟基取代的芳香族化合物和取代的含羟基的芳族化合物。 当三偶氮二色性染料用作主体液晶材料中的客体染料时，它们形成用于液晶显示器的新型液晶组合物。 R 1和R 2的实例包括氨基喹啉，四氢喹啉，N-乙基-1-萘胺和1,8-二氨基萘的有机基团。
-
公开(公告)号：US5182188A
公开(公告)日：1993-01-26
申请号：US546230
申请日：1990-06-29
申请人： Herbert S. Cole, Jr. , James W. Rose , Renato Guida , Yung S. Liu
发明人： Herbert S. Cole, Jr. , James W. Rose , Renato Guida , Yung S. Liu
CPC分类号： G03F7/2053 , H05K3/0082 , Y10S430/146
摘要： Self-developing photoresists are developed by exposing the substrate on which they are exposed to a light beam or other energy source which is absorbed by the substrate and which raises the substrate temperature to the thermal decomposition temperature of the overlying photoresist. This exposure may be done through the photoresist layer with a light beam having a frequency to which the photoresist is substantially transparent or may be done from the backside of the substrate using a light beam which is absorbed by the substrate itself if it is sufficiently thin, or by a thin layer disposed on a transparent substrate.
摘要翻译： 通过将它们暴露在其上的衬底暴露于由衬底吸收的光束或其他能量源并且将衬底温度升高到覆盖的光致抗蚀剂的热分解温度来开发自显影光刻胶。 这种曝光可以通过具有光致抗蚀剂基本上透明的频率的光束来进行，或者可以使用如由足够薄的衬底自身吸收的光束从衬底的背面进行， 或通过设置在透明基板上的薄层。
-
公开(公告)号：US4378302A
公开(公告)日：1983-03-29
申请号：US217267
申请日：1980-12-16
摘要： Liquid crystal compositions having guest perylene-based dichroic dyes dissolved therein. The perylene dichroic dyes have symmetrically-disposed substituents which are preferably a group forming with the 3,4 and 9, 10 carbons, respectively, a 5 or 6 membered cyclic ring which is substituted by, or fused to, a phenyl ring. The perylene-based dyes of the invention can be used alone or with other compatible dyes as guest dyes to form various colors for coloring the host liquid crystal compositions.
摘要翻译： 在其中溶解有苝基二色性染料的液晶组合物。 苝二色性染料具有对称排列的取代基，其优选为分别具有3,4和9,10个碳的基团，其被苯环取代或与苯环稠合的5或6元环。 本发明的苝类染料可以单独使用或与其它相容的染料一起使用，作为客体染料，以形成用于着色主体液晶组合物的各种颜色。
-
10.发明授权Dichroic liquid crystal composition with 4,4-bis (substituted naphthylazo)azobenzene dichroic dyes 失效二色液晶组合物与4,4-双（取代萘偶氮）偶氮苯二色染料
公开(公告)号：US4122027A
公开(公告)日：1978-10-24
申请号：US739629
申请日：1976-11-08
CPC分类号： C09K19/601 , G03C7/3335
摘要： Dichroic dyes of the 4,4'-Bis-(substituted naphthylazo)azobenzene type, each having three azo (--N.dbd.N--) bonding groups, provide a high order parameter in excess of 0.70, when dissolved in liquid crystal mixtures to provide contrast ratios on the order of 10:1.
摘要翻译： 当溶解在液晶混合物中时，具有三个偶氮（-N = N-）键合基团的4,4'-双 - （取代萘基偶氮）偶氮苯的二色性染料提供超过0.70的高阶参数 对比度约为10：1。
-
-
-
-
-
-
-
-
-
搜索结果
31 条记录 (耗时 0.027 秒)
