A method of making a mold from a model is disclosed. A mold carrier is formed having an aperture therein. The aperture has a configuration generally corresponding to the shape of the model. The model is positioned within the aperture such that a space is created between the outer peripheral surface of the aperture and the outer peripheral surface of the model. A resilient first material in its liquid state is poured into the space such that the first material substantially covers the outer peripheral surface of the model. The resilient first material is allowed to solidify in the space such that a resilient mold insert is formed. The mold insert forms an impression of the outer peripheral surface of the model and is disposed along the inner peripheral surface of the aperture. The model is removed from the resilient mold insert. A second material in its liquid state is poured into the aperture of the mold carrier with the resilient mold insert disposed along the inner peripheral surface of the aperture. The second material is allowed to solidify such that a duplicate of the model is formed. The duplicate replicates the outer peripheral surface of the model because of its contact with the resilient mold insert. The duplicate is removed from the resilient mold insert. A mold is formed from the duplicate. The mold formed is used in making replicas of the model.