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发明授权
US5443865A Method for conditioning a substrate for subsequent electroless metal deposition 失效
用于调理用于随后的无电金属沉积的衬底的方法

Method for conditioning a substrate for subsequent electroless metal deposition
摘要：
Substrates are activated for subsequent metallization by contacting the substrate with a electrolyte in which reducing agents which are electrochemically generated in the electrolyte. The reducing agents are sorbed by the substrate which is contacted with a seeding medium to dispose on the substrate seed, preferably palladium seed for subsequent electroless and electrolytic metallization.
摘要（中）：

通过使基底与电解质接触而将底物活化用于随后的金属化，其中在电解质中电化学产生还原剂。 还原剂被底物吸附，其与接种介质接触以配置在底物种子上，优选钯种子用于随后的无电解和电解金属化。

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