发明授权
- 专利标题: Purge gas in wafer coating area selection
- 专利标题(中): 在晶圆涂层区域选择吹扫气体
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申请号: US902995申请日: 1992-06-23
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公开(公告)号: US5447570A公开(公告)日: 1995-09-05
- 发明人: Johannes J. Schmitz , Frederick J. Scholz , Norman L. Turner , Raymond L. Chow , Frank O. Uher , Sien G. Kang , Steven C. Selbrede
- 申请人: Johannes J. Schmitz , Frederick J. Scholz , Norman L. Turner , Raymond L. Chow , Frank O. Uher , Sien G. Kang , Steven C. Selbrede
- 申请人地址: CA Sunnyvale
- 专利权人: Genus, Inc.
- 当前专利权人: Genus, Inc.
- 当前专利权人地址: CA Sunnyvale
- 主分类号: C23C16/04
- IPC分类号: C23C16/04 ; C23C16/44 ; C23C16/455 ; C23C16/458 ; H01L21/687 ; C23C16/00
摘要:
Apparatus including a support and purge gas supply prevents edge and backside coating on a wafer in manufacture of integrated circuits. Various enclosure elements and methods are disclosed for containing and directing purge gas, and a CVD system is provided incorporating the elements of the invention.
公开/授权文献
- US5758565A Diaphragm assembly and method of manufacturing same 公开/授权日:1998-06-02