Invention Grant
- Patent Title: Injection mold device
- Patent Title (中): 注塑设备
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Application No.: US76915Application Date: 1993-06-15
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Publication No.: US5456588APublication Date: 1995-10-10
- Inventor: Hiroshi Yonekubo , Kaoru Maeda , Tetsuo Suga , Kazuo Saito , Shoso Nishida
- Applicant: Hiroshi Yonekubo , Kaoru Maeda , Tetsuo Suga , Kazuo Saito , Shoso Nishida
- Applicant Address: JPX Tokyo
- Assignee: Olympus Optical Co. Ltd.
- Current Assignee: Olympus Optical Co. Ltd.
- Current Assignee Address: JPX Tokyo
- Priority: JPX4-180359 19920615; JPX4-293911 19921007; JPX5-136444 19930514
- Main IPC: B29C45/04
- IPC: B29C45/04 ; B29C45/12 ; B29C45/17 ; B29C45/64 ; B29C45/10
Abstract:
An injection mold device comprises a first matrix attached to a movable platen and a second matrix attached to a fixed platen. A multiplicity of first cavity units are attached to the first matrix. A multiplicity of second cavity units are provided for selective removable attachment to the first matrix during a mold-clamping state and to the second matrix during a mold-opening state. A self-holding device is associated with the first matrix for maintaining a clamping force between the first cavity units and the second cavity units during the mold-clamping state. A mold-opening device is associated with the second matrix for removably attaching the second cavity units to the first matrix in the mold-clamping state and for removing the second cavity units from the first matrix in the mold-opening state.
Public/Granted literature
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