发明授权
US5461775A Method for mounting electronic component on a flexible printed circuit
board
失效
将电子部件安装在柔性印刷电路板上的方法
- 专利标题： Method for mounting electronic component on a flexible printed circuit board
- 专利标题（中）： 将电子部件安装在柔性印刷电路板上的方法
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申请号： US230033申请日： 1994-04-19
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公开(公告)号： US5461775A公开(公告)日： 1995-10-31
- 发明人: Kouji Tanabe , Naohiro Nishioka
- 申请人： Kouji Tanabe , Naohiro Nishioka
- 申请人地址： JPX Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX Osaka
- 优先权： JPX5-100911 19930427
- 主分类号： H05K3/28
- IPC分类号： H05K3/28 ; H05K1/00 ; H05K1/09 ; H05K1/11 ; H05K1/18 ; H05K3/24 ; H05K3/32 ; H05K3/40 ; H05K3/46 ; H05K3/34
摘要：
A flexible printed circuit board is constituted with a first insulation film covering a first insulating resist layer, a second insulation film covering a second insulating resist layer and a printed circuit formed between the first insulating resist layer and the second insulating resist layer, and a terminal of an electronic component is disposed on the printed circuit, and the second insulation film is pressed and heated.
公开/授权文献
- US4938507A Business form with repositionable labels 公开/授权日：1990-07-03