发明授权
US5472899A Process for fabrication of an SRAM cell having a highly doped storage
node
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具有高掺杂存储节点的SRAM单元的制造工艺
- 专利标题: Process for fabrication of an SRAM cell having a highly doped storage node
- 专利标题(中): 具有高掺杂存储节点的SRAM单元的制造工艺
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申请号: US216353申请日: 1994-03-23
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公开(公告)号: US5472899A公开(公告)日: 1995-12-05
- 发明人: Chen-Chiu Hsue , Sun-Chieh Chien
- 申请人: Chen-Chiu Hsue , Sun-Chieh Chien
- 申请人地址: TWX Hsinchu
- 专利权人: United Microelectronics Corporation
- 当前专利权人: United Microelectronics Corporation
- 当前专利权人地址: TWX Hsinchu
- 主分类号: H01L21/8244
- IPC分类号: H01L21/8244 ; H01L21/70 ; H01L27/00
摘要:
An SRAM cell and a process for forming an SRAM cell comprises: forming a gate oxide layer on a semiconductor substrate, forming a gate on the gate oxide layer, forming a first ion implantation into the substrate in areas adjacent to the gate, performing a second ion implantation in an area immediately adjacent to the gate, depositing a dielectric layer over the gates, etching the dielectric layer to form a spacer structure therefrom, with the remainder of the dielectric layer being removed by the etching, and a third ion implantation in the substrate in all regions adjacent to the gates and the spacer forming more highly doped regions adjacent to the gate and the spacer.
公开/授权文献
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