发明授权
US5480834A Process of manufacturing an electrical bonding interconnect having a
metal bond pad portion and having a conductive epoxy portion comprising
an oxide reducing agent
失效
制造具有金属接合焊盘部分并且具有包含氧化物还原剂的导电环氧树脂部分的电接合互连的方法
- 专利标题： Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent
- 专利标题（中）： 制造具有金属接合焊盘部分并且具有包含氧化物还原剂的导电环氧树脂部分的电接合互连的方法
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申请号： US166747申请日： 1993-12-13
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公开(公告)号： US5480834A公开(公告)日： 1996-01-02
- 发明人: Rickie C. Lake , Mark E. Tuttle
- 申请人： Rickie C. Lake , Mark E. Tuttle
- 申请人地址： ID Boise
- 专利权人： Micron Communications, Inc.
- 当前专利权人： Micron Communications, Inc.
- 当前专利权人地址： ID Boise
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/485 ; H05K3/32 ; H01L21/288
摘要：
A process for manufacturing a low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed during the fabrication of the bonding interconnect.
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