发明授权
- 专利标题： Surface mountable leaded package
- 专利标题（中）： 表面贴装铅封包装
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申请号： US85806申请日： 1993-07-06
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公开(公告)号： US5487674A公开(公告)日： 1996-01-30
- 发明人: Andrzej T. Guzik , Todd L. Smith , Jeffrey P. Marchuk
- 申请人： Andrzej T. Guzik , Todd L. Smith , Jeffrey P. Marchuk
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： H01R4/02
- IPC分类号： H01R4/02 ; H01R13/24
摘要：
A method and an apparatus provide a surface mountable package (100) with leads (150) having free end portions (355) coplanar in a target plane (370). The method includes forming the leads (150) such that the free end portions (355) angle away from the target plane (370), and biasing the free end portions (355) against a biasing surface (365) integral to the package (100) such that the free end portions (355) are forced toward the target plane (370) and into a coplanar state. The apparatus includes a housing (110), a plurality of leads (150) with free end portions (355) preformed to angle away from the target plane (370) mounted onto the housing (110), and a biasing surface (365), located on the package (100), to bias the free end portions (355) toward the target plane (370).
公开/授权文献
- USD408142S Container for toy elements 公开/授权日：1999-04-20
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