Invention Grant
- Patent Title: RC array
- Patent Title (中): RC阵列
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Application No.: US271263Application Date: 1994-07-06
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Publication No.: US5495387APublication Date: 1996-02-27
- Inventor: Harufumi Mandai , Yoshikazu Chigodo , Kazuhiro Iida
- Applicant: Harufumi Mandai , Yoshikazu Chigodo , Kazuhiro Iida
- Applicant Address: JPX
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JPX
- Priority: JPX3-200204 19910809; JPX3-200205 19910809; JPX3-200206 19910809
- Main IPC: H01G4/38
- IPC: H01G4/38 ; H03H1/02 ; H01G2/20 ; H01G4/228 ; H03H7/00
Abstract:
A plurality of capacitor elements defined by first and second capacitor electrodes are formed in the interior of a laminated ceramic block, while a plurality of first terminal electrodes to be electrically connected to the first capacitor electrodes and a ground terminal electrode to be connected to the second capacitor electrodes in common are formed on one side surface of the block. A plurality of resistor films are formed on a major surface of the block, to be connected to the first terminal electrodes. A plurality of second terminal electrodes are formed on another side surface of the block, to be electrically connected to the resistor films. Another ground terminal electrode is formed on this side surface, to be connected to the second capacitor electrodes in common. Thus, an RC array being applicable to a high frequency filter array is integrated and miniaturized to cope with high density packaging, as well as to enable surface mounting.
Public/Granted literature
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