发明授权
US5496639A Poly(arylene ether imidazole) surfacing films for flat and parabolic
structures
失效
用于平面和抛物线结构的聚(亚芳基醚咪唑)表面膜
- 专利标题: Poly(arylene ether imidazole) surfacing films for flat and parabolic structures
- 专利标题(中): 用于平面和抛物线结构的聚(亚芳基醚咪唑)表面膜
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申请号: US238102申请日: 1994-05-04
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公开(公告)号: US5496639A公开(公告)日: 1996-03-05
- 发明人: John W. Connell , Timothy W. Towell , Stephen S. Tompkins
- 申请人: John W. Connell , Timothy W. Towell , Stephen S. Tompkins
- 申请人地址: DC Washington
- 专利权人: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
- 当前专利权人: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
- 当前专利权人地址: DC Washington
- 主分类号: H01Q15/14
- IPC分类号: H01Q15/14
摘要:
Films of thermoplastic poly(arylene ether imidazole)s (PAEI)s are used as surface modifiers for neat resin panels and composite resin panels. The PAEI polymer contains imidazole groups along the backbone which co-cure, i.e., react chemically, with epoxies or bismaleimides during processing and thereby provide excellent adhesion between the PAEI film and an epoxy or bismaleimide neat resin or composite resin facesheet. The film provides good adhesion and a smooth surface to the finished part and acts as a release agent from the mold. The as-processed integral structures have very smooth (specular) surfaces, and since the film releases readily from a glass mold, no release agent is necessary. The PAEI film is thermally stable, resistant to electron radiation, and adheres tenaciously to the facesheet. The film maintains good adhesion even after thermal cycling from room temperature to .about. -196.degree. C.
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