公开(公告)号：US5496639A

公开(公告)日：1996-03-05

申请号：US238102

申请日：1994-05-04

申请人： John W. Connell ,  Timothy W. Towell ,  Stephen S. Tompkins

发明人： John W. Connell ,  Timothy W. Towell ,  Stephen S. Tompkins

IPC分类号： H01Q15/14

CPC分类号： H01Q15/141 ,  Y10T428/31511 ,  Y10T428/31721

摘要： Films of thermoplastic poly(arylene ether imidazole)s (PAEI)s are used as surface modifiers for neat resin panels and composite resin panels. The PAEI polymer contains imidazole groups along the backbone which co-cure, i.e., react chemically, with epoxies or bismaleimides during processing and thereby provide excellent adhesion between the PAEI film and an epoxy or bismaleimide neat resin or composite resin facesheet. The film provides good adhesion and a smooth surface to the finished part and acts as a release agent from the mold. The as-processed integral structures have very smooth (specular) surfaces, and since the film releases readily from a glass mold, no release agent is necessary. The PAEI film is thermally stable, resistant to electron radiation, and adheres tenaciously to the facesheet. The film maintains good adhesion even after thermal cycling from room temperature to .about. -196.degree. C.

摘要翻译： 热塑性聚（亚芳基醚咪唑）（PAEI）的膜用作纯树脂板和复合树脂板的表面改性剂。 PAEI聚合物包含沿着主链的咪唑基，其在加工期间与环氧化物或双马来酰亚胺共固化，即化学反应，从而提供PAEI膜与环氧或双马来酰亚胺纯树脂或复合树脂面之间的优异粘合性。 该膜提供良好的粘附性和光滑的表面到成品部分并充当脱模剂从模具。 经处理的整体结构具有非常光滑的（镜面）表面，并且由于膜容易从玻璃模具中释放，因此不需要脱模剂。 PAEI膜是热稳定的，耐电子辐射，并且牢固地粘附在面板上。 即使在从室温到DIFFERENCE -196℃的热循环之后，该膜也保持良好的附着力。

公开(公告)号：US07704553B2

公开(公告)日：2010-04-27

申请号：US11710386

申请日：2007-02-23

申请人： Kent A. Watson ,  Michael J. Fallbach ,  Sayata Ghose ,  Joseph G. Smith ,  Donavon M. Delozier ,  John W. Connell

发明人： Kent A. Watson ,  Michael J. Fallbach ,  Sayata Ghose ,  Joseph G. Smith ,  Donavon M. Delozier ,  John W. Connell

IPC分类号： B05D7/00 ,  B05D3/02

CPC分类号： C08J5/005 ,  B22F1/0018 ,  B22F9/20 ,  B22F2999/00 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/05 ,  C01B32/152 ,  C01B32/168 ,  C01B32/20 ,  C01B32/25 ,  C01B2202/02 ,  C01B2202/06 ,  C22C2026/001 ,  C22C2026/002 ,  Y10T428/31678 ,  B22F9/04 ,  B22F2203/11

摘要： A process for depositing nanometer-sized metal particles onto a substrate in the absence of aqueous solvents, organic solvents, and reducing agents, and without any required pre-treatment of the substrate, includes preparing an admixture of a metal compound and a substrate by dry mixing a chosen amount of the metal compound with a chosen amount of the substrate; and supplying energy to the admixture in an amount sufficient to deposit zero valance metal particles onto the substrate. This process gives rise to a number of deposited metallic particle sizes which may be controlled. The compositions prepared by this process are used to produce polymer composites by combining them with readily available commodity and engineering plastics. The polymer composites are used as coatings, or they are used to fabricate articles, such as free-standing films, fibers, fabrics, foams, molded and laminated articles, tubes, adhesives, and fiber reinforced articles. These articles are well-suited for many applications requiring thermal conductivity, electrical conductivity, antibacterial activity, catalytic activity, and combinations thereof.

摘要翻译： 在不含水溶剂，有机溶剂和还原剂的情况下将纳米尺寸金属颗粒沉积到基底上的方法，并且不需要对基底进行任何必要的预处理，包括通过干燥制备金属化合物和基底的混合物 将选定量的金属化合物与选定量的底物混合; 并且以足以将零价金属颗粒沉积到基底上的量向混合物供应能量。 该方法产生可以控制的多个沉积的金属颗粒尺寸。 通过该方法制备的组合物用于通过将它们与容易获得的商品和工程塑料组合来生产聚合物复合材料。 聚合物复合材料用作涂层，或者它们用于制造制品，例如自立膜，纤维，织物，泡沫，模制和层压制品，管，粘合剂和纤维增强制品。 这些制品非常适用于需要导热性，导电性，抗菌活性，催化活性及其组合的许多应用。

公开(公告)号：US06441099B1

公开(公告)日：2002-08-27

申请号：US09726297

申请日：2000-11-28

申请人： John W. Connell ,  Joseph G. Smith, Jr. ,  Paul M. Hergenrother

发明人： John W. Connell ,  Joseph G. Smith, Jr. ,  Paul M. Hergenrother

IPC分类号： C08J300

CPC分类号： C08G73/101 ,  C08F251/00 ,  C08F281/00 ,  C08F290/14 ,  C08G73/10

摘要： Phenylethynyl containing reactive additives were prepared from aromatic diamines containing phenylethynyl groups and various ratios of phthalic anhydride and 4-phenylethynylphthalic anhydride in glacial acetic acid to form the imide in one step or in N-methyl-2-pyrrolidinone to form the amide acid intermediate. The reactive additives were mixed in various amounts (10% to 90%) with oligomers containing either terminal or pendent phenylethynyl groups (or both) to reduce the melt viscosity and thereby enhance processability. Upon thermal cure, the additives react and become chemically incorporated into the matrix and effect an increase in crosslink density relative to that of the host resin. This resultant increase in crosslink density has advantageous consequences on the cured resin properties such as higher glass transition temperature and higher modulus as compared to that of the host resin.

公开(公告)号：US06359107B1

公开(公告)日：2002-03-19

申请号：US09575826

申请日：2000-05-18

申请人： John W. Connell ,  Joseph G. Smith ,  Paul M. Hergenrother

发明人： John W. Connell ,  Joseph G. Smith ,  Paul M. Hergenrother

IPC分类号： C08G7310

CPC分类号： C09J179/08 ,  C08G73/101 ,  C08G73/1014 ,  C08G73/1042 ,  C09D179/08 ,  Y10S526/935 ,  Y10T428/2969 ,  Y10T428/31504 ,  Y10T428/31721

摘要： A composition of and method for making high performance imide resins that are processable by resin transfer molding (RTM) and resin infusion (RI) techniques were developed. Materials with a combination of properties, making them particularly useful for the fabrication of composite parts via RTM and/or RI processes, were prepared, characterized and fabricated into moldings and carbon fiber reinforced composites and their mechanical properties were determined. These materials are particularly useful for the fabrication of structural composite components for aerospace applications. The method for making high performance resins for RTM and RI processes is a multi-faceted approach. It involves the preparation of a mixture of products from a combination of aromatic diamines and aromatic dianhydrides at relatively low calculated molecular weights (i.e. high stoichiometric offsets) and endcapping with latent reactive groups. The combination of these monomers results in a mixture of products, in the imide form, that exhibits a stable melt viscosity of less than approximately 60 poise below approximately 300° C.

摘要翻译： 开发了可通过树脂传递模塑（RTM）和树脂浸渍（RI）技术加工的制备高性能酰亚胺树脂的组合物和方法。 制备具有组合性能的材料，使其对于通过RTM和/或RI工艺制造复合材料部分特别有用，其特征和制造成模制品和碳纤维增强复合材料，并确定其机械性能。 这些材料对于制造用于航空航天应用的结构复合材料部件特别有用。 用于制造RTM和RI工艺的高性能树脂的方法是一种多方面的方法。 它涉及以相当低的计算分子量（即高化学计量偏移）和具有潜在反应性基团的封端物从芳族二胺和芳族二酸酐的组合制备产物的混合物。 这些单体的组合产生了酰亚胺形式的产物的混合物，其在约300℃以下显示出小于约60泊的稳定的熔融粘度。

公开(公告)号：US5637670A

公开(公告)日：1997-06-10

申请号：US376170

申请日：1995-01-20

申请人： John W. Connell ,  Paul M. Hergenrother ,  Joseph G. Smith, Jr.

发明人： John W. Connell ,  Paul M. Hergenrother ,  Joseph G. Smith, Jr.

IPC分类号： C08G73/18 ,  C09J179/04 ,  C08G73/08

CPC分类号： C08G73/18 ,  C09J179/04 ,  Y10S526/935 ,  Y10T428/31504

摘要： Novel molecular weight controlled and endcapped polybenzimidazoles (PBI) are prepared by the aromatic nucleophilic displacement reaction of di(hydroxyphenylbenzimidazole) monomers with activated aromatic dihalides or activated aromatic dinitro compounds. The PBI are endcapped with mono(hydroxyphenyl)benzimidazoles. The polymerizations are carried out in polar aprotic solvents such as N-methyl-2-pyrrolidinone or N,N-dimethylacetamide using alkali metal bases such as potassium carbonate at elevated temperatures under nitrogen. Mono(hydroxyphenyl)benzimidazoles are synthesized by reacting phenyl-4-hydroxybenzoate with aromatic (o-diamine)s in diphenylsulfone. Molecular weight controlled and endcapped PBI of new chemical structures are prepared that exhibit a favorable combination of physical and mechanical properties.

摘要翻译： 通过二（羟基苯基苯并咪唑）单体与活性芳族二卤化物或活性芳族二硝基化合物的芳族亲核置换反应制备新型分子量控制和封端的聚苯并咪唑（PBI）。 PBI被单（羟基苯基）苯并咪唑封端。 聚合在极性非质子溶剂如N-甲基-2-吡咯烷酮或N，N-二甲基乙酰胺中，使用碱金属碱如碳酸钾，在氮气下在升高的温度下进行。 通过苯基-4-羟基苯甲酸酯与二苯砜中的芳族（邻二胺）反应合成单（羟基苯基）苯并咪唑。 制备新化学结构的分子量控制和封端的PBI，其表现出物理和机械性质的有利组合。

公开(公告)号：US5554715A

公开(公告)日：1996-09-10

申请号：US375334

申请日：1995-01-17

申请人： John W. Connell ,  Paul M. Hergenrother ,  Joseph G. Smith, Jr.

发明人： John W. Connell ,  Paul M. Hergenrother ,  Joseph G. Smith, Jr.

IPC分类号： C08G73/18

CPC分类号： C08G73/18

摘要： Novel poly(N-arylenebenzimidazole)s (PNABls) are prepared by the aromatic nucleophilic displacement reaction of novel di(hydroxyphenyl-N-arylene benzimidazole) monomers with activated aromatic dihalides or activated aromatic dinitro compounds. The polymerizations are carried out in polar aprotic solvents such as N-methyl-2-pyrrolidinone or N,N-dimethylacetamide using alkali metal bases such as potassium carbonate at elevated temperatures under nitrogen. The di(hydroxyphenyl-N-arylenebenzimidazole) monomers are synthesized by reacting phenyl-4-hydroxybenzoate with bis(2-aminoanilino)arylenes in diphenylsulfone. Moderate molecular weight PNABIs of new chemical structures were prepared that exhibit a favorable combination of physical and mechanical properties. The use of the novel di(hydroxyphenyI-N-arylenebenzimidazole)s permits a more economical and easier way to prepare PNABIs than previous routes.

摘要翻译： 通过新型二（羟基苯基-N-亚芳基苯并咪唑）单体与活性芳族二卤化物或活性芳族二硝基化合物的芳族亲核置换反应制备新型聚（N-亚芳基苯并咪唑）（PNABls）。 聚合在极性非质子溶剂如N-甲基-2-吡咯烷酮或N，N-二甲基乙酰胺中，使用碱金属碱如碳酸钾，在氮气下在升高的温度下进行。 二（羟基苯基-N-亚芳基苯并咪唑）单体通过苯基-4-羟基苯甲酸酯与二（2-氨基苯胺基）亚芳基在二苯基砜中反应合成。 制备中等分子量的新化学结构的PNABI，其表现出物理和机械性能的有利组合。 新型二（羟基苯基）-N-亚芳基苯并咪唑的使用允许比以前的路线更经济和更容易的制备PNABI的方法。

公开(公告)号：US5182356A

公开(公告)日：1993-01-26

申请号：US650336

申请日：1991-01-24

申请人： John W. Connell ,  Paul M. Hergenrother ,  Peter Wolf

发明人： John W. Connell ,  Paul M. Hergenrother ,  Peter Wolf

IPC分类号： C08G73/08

CPC分类号： C08G73/08

摘要： Poly(1,2,4-triazoles)(PT) have been prepared by involving the aromatic nucleophilic displacement reaction of di(hydroxyphenyl)-1,2,4-triazole monomers with activated aromatic dihalides or activated aromatic dinitro compounds. The reactions are carried out in polar aprotic solvents such as sulfolane or diphenylsulfone using alkali metal bases such as potassium carbonate at elevated temperatures under nitrogen. The di(hydroxyphenyl)-1,2,4-triazole monomers are first synthesized by reacting bis(4-hydroxyphenyl) hydrazide with aniline hydrochloride at 250.degree. C. in the melt and also by reacting 1,3 or 1,4-bis-(4-hydroxyphenyl)phenylenedihydrazide with 2 moles of aniline hydrochloride in the melt. Purification of the di(hydroxyphenyl)-1,2,4-triazole monomers is accomplished by recrystallization. This synthetic route has provided high molecular weight PT of new chemical structure, is economically and synthetically more favorable than other routes, and allows for facile chemical structure variation due to the availability of a large variety of activated aromatic dihalides.

摘要翻译： 通过涉及二（羟基苯基）-1,2,4-三唑单体与活性芳族二卤化物或活性芳族二硝基化合物的芳族亲核取代反应制备了聚（1,2,4-三唑）（PT）。 反应在极性非质子溶剂如环丁砜或二苯基砜中，使用碱金属碱如碳酸钾在氮气下在升高的温度下进行。 二（羟基苯基）-1,2,4-三唑单体首先通过双（4-羟基苯基）酰肼与苯胺盐酸盐在250℃下在熔体中反应，并通过使1,3或1,4-双 - （4-羟基苯基）亚苯基二酰肼与2摩尔苯胺盐酸盐在熔体中反应。 二（羟基苯基）-1,2,4-三唑单体的纯化是通过重结晶实现的。 这种合成路线提供了新的化学结构的高分子量PT，在经济上和综合性上比其他途径更有利，并且由于大量活性芳族二卤化物的可用性而允许容易的化学结构变化。

公开(公告)号：US08790773B2

公开(公告)日：2014-07-29

申请号：US12174360

申请日：2008-07-16

申请人： Kenneth L. Dudley ,  Holly A Elliott ,  John W. Connell ,  Joseph G. Smith ,  Sayata Ghose ,  Kent A. Watson ,  Donavon Mark Delozier

发明人： Kenneth L. Dudley ,  Holly A Elliott ,  John W. Connell ,  Joseph G. Smith ,  Sayata Ghose ,  Kent A. Watson ,  Donavon Mark Delozier

IPC分类号： B32B5/16 ,  C08K3/08

CPC分类号： C08K3/08 ,  B82Y30/00 ,  C08K2201/011

摘要： A dielectric material includes a network of nanosubstrates, such as but not limited to nanotubes, nanosheets, or other nanomaterials or nanostructures, a polymer base material or matrix, and nanoparticles constructed at least partially of an elemental metal. The network has a predetermined nanosubstrate loading percentage by weight with respect to a total weight of the dielectric material, and a preferential or predetermined longitudinal alignment with respect to an orientation of an incident electrical field. A method of forming the dielectric material includes depositing the metal-based nanoparticles onto the nanosubstrates and subsequently mixing these with a polymer matrix. Once mixed, alignment can be achieved by melt extrusion or a similar mechanical shearing process. Alignment of the nanosubstrate may be in horizontal or vertical direction with respect to the orientation of an incident electrical field.

摘要翻译： 电介质材料包括纳米基层网络，例如但不限于纳米管，纳米片或其它纳米材料或纳米结构，聚合物基材或基体，以及至少部分由元素金属构成的纳米颗粒。 网络具有相对于电介质材料的总重量的预定的纳米基质载荷百分比，以及相对于入射电场的取向的优选或预定的纵向对准。 形成电介质材料的方法包括将金属基纳米颗粒沉积到纳米基板上，随后将其与聚合物基体混合。 一旦混合，可以通过熔体挤出或类似的机械剪切工艺来实现对准。 纳米基板的对准可以相对于入射电场的取向在水平或垂直方向上。

公开(公告)号：US20120252968A1

公开(公告)日：2012-10-04

申请号：US13286715

申请日：2011-11-01

申请人： Christopher J. Wohl ,  John W. Connell ,  Emilie J. Siochi ,  Joseph G. Smith

发明人： Christopher J. Wohl ,  John W. Connell ,  Emilie J. Siochi ,  Joseph G. Smith

IPC分类号： C09D167/00 ,  B05D3/00 ,  C07D305/08 ,  B05D7/24 ,  C08G63/682 ,  C08L67/00

CPC分类号： C07D305/08 ,  C08G65/18 ,  C08G65/322 ,  C08G65/33389 ,  C08G73/1042 ,  C08G73/105 ,  C09D179/08

摘要： Copoly(imide oxetane) materials are disclosed that can exhibit a low surface energy while possessing the mechanical, thermal, chemical and optical properties associated with polyimides. The copoly(imide oxetane)s are prepared using a minor amount of fluorinated oxetane-derived oligomer with sufficient fluorine-containing segments of the copoly(imide oxetane)s that migrate to the exterior surface of the polymeric material to yield low surface energies. Thus the coatings and articles of manufacture made with the copoly(imide oxetane)s of this invention are characterized as having an anisotropic fluorine composition. The low surface energies can be achieved with very low content of fluorinated oxetane-derived oligomer. The copolymers of this invention can enhance the viability of polyimides for many applications and may be acceptable where homopolyimide materials have been unacceptable.

摘要翻译： 公开了共聚（酰亚胺氧杂环丁烷）材料，其具有低表面能，同时具有与聚酰亚胺相关的机械，热学，化学和光学性能。 使用少量的具有足够的共聚（酰亚胺氧杂环丁烷）的含氟链段的氟化氧杂环丁烷衍生的低聚物制备共聚（酰亚胺氧杂环丁烷），其迁移到聚合物材料的外表面以产生低的表面能。 因此，用本发明的共聚（酰亚胺氧杂环丁烷）制备的涂料和制品被表征为具有各向异性氟组合物。 低表面能可以用非常低含量的氟化氧乙烷衍生的低聚物来实现。 本发明的共聚物可以增强聚酰亚胺在许多应用中的存活力，并且在均聚酰亚胺材料已经不可接受的情况下可以是可接受的。

公开(公告)号：US20110045223A1

公开(公告)日：2011-02-24

申请号：US12546185

申请日：2009-08-24

申请人： Yi Lin ,  John W. Connell

发明人： Yi Lin ,  John W. Connell

IPC分类号： B32B1/08 ,  C01B21/064 ,  C01B35/10 ,  C01B35/00 ,  C07K2/00 ,  C08K3/38 ,  B01J19/12 ,  B32B5/16 ,  C08F110/00 ,  C08F6/00

CPC分类号： C01B21/0687 ,  C01P2002/85 ,  C01P2004/20 ,  Y10T428/139 ,  Y10T442/699

摘要： A new method is disclosed for the exfoliation of hexagonal boron nitride into mono- and few-layered nanosheets (or nanoplatelets, nanomesh, nanoribbons). The method does not necessarily require high temperature or vacuum, but uses commercially available h-BN powders (or those derived from these materials, bulk crystals) and only requires wet chemical processing. The method is facile, cost efficient, and scalable. The resultant exfoliated h-BN is dispersible in an organic solvent or water thus amenable for solution processing for unique microelectronic or composite applications.

摘要翻译： 公开了一种将六角形氮化硼剥离成单层和几层纳米片（或纳米片，纳米片，纳米带）的新方法。 该方法不一定需要高温或真空，但使用市售的h-BN粉末（或衍生自这些材料的本体晶体）的粉末，并且仅需要湿化学处理。 该方法简便，成本效益高，可扩展。 所得到的剥离的h-BN可分散在有机溶剂或水中，因此适用于独特的微电子或复合应用的溶液处理。