A test apparatus and method for testing circuitized substrates such as printed circuit boards or ceramic substrates having one or more chips thereon. The apparatus includes one substrate (e.g., printed circuit board) located on a base and adapted for having another circuitized substrate (e.g., flexible circuit) positioned thereon and electrically coupled to conductive elements (e.g., copper pads) thereof. Elastomeric members may be used to force the flexible circuit against the conductors of the substrate being tested, this substrate positioned either within or upon a cover which is located over the flexible circuit and which assists in compressing the flexible circuit against the printed circuit board's conductive elements to assure positive connection therewith. The cover may also include elastomeric members to facilitate such connection and a pivotal arm for being actuated to engage the substrate being tested. Positioning as well as relative quick separation (removal) of the substrate is attainable upon completion of the testing.