A thermal barrier in the form of a base material with a plurality of microcapsules containing a phase change material forms an insulative pad, such as a shoe insole. The microcapsules are surroundingly encapsulated and embedded within the base material. In addition, substantially all of the microcapsules are spaced apart from each other, the space between neighboring adjacent microcapsules containing a phase change material. The microcapsules may be anisotropically distributed to further reduce thermal conductivity of heat through the thermal barrier.