Invention Grant
- Patent Title: Method of manufacturing collinear terminated transmission line structure with thick film circuitry
- Patent Title (中): 使用厚膜电路制造共线端接传输线结构的方法
-
Application No.: US397594Application Date: 1995-03-02
-
Publication No.: US5504986APublication Date: 1996-04-09
- Inventor: John F. Casey , Ronald W. Schroeder , Lewis R. Dove , Philip J. Yearsley
- Applicant: John F. Casey , Ronald W. Schroeder , Lewis R. Dove , Philip J. Yearsley
- Applicant Address: CA Palo Alto
- Assignee: Hewlett-Packard Company
- Current Assignee: Hewlett-Packard Company
- Current Assignee Address: CA Palo Alto
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01C17/065 ; H01C17/242 ; H01L23/64 ; H01L27/01 ; H05K1/09 ; H05K1/16 ; H05K3/02 ; H01C17/06
Abstract:
A collinear terminated transmission line structure and method for producing same is presented. The structure comprises a plurality of conductors electrically connected to a plurality of resistors. A predetermined spacing between each of the plurality of conductors ranges from 2 mils to 7 mils. Greater spacings are easily accomplished with the present method. The method comprises the steps of screen-printing a resistor swath onto a substrate, the swath being adjacent to one end of the plurality of conductors. After the substrate is dipped into a solution, the resistor swath is laser trimmed to form the plurality of resistors. The substrate is then rinsed with warm water to remove the solution. The solution can be a poly-vinyl alcohol and isopropyl alcohol mixture.
Public/Granted literature
- US6145552A Particulate product following system and method Public/Granted day:2000-11-14
Information query