- 专利标题： Polyimides, process for the preparation thereof and polyimide resin compositions
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申请号： US335332申请日： 1994-11-03
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公开(公告)号： US5506311A公开(公告)日： 1996-04-09
- 发明人: Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
- 申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
- 申请人地址： JPX Tokyo
- 专利权人： Mitsui Toatsu Chemicals, Inc.
- 当前专利权人： Mitsui Toatsu Chemicals, Inc.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX62-126320 19870520; JPX62-134830 19870601; JPX62-134831 19870601; JPX62-138203 19870603; JPX62-138204 19870603; JPX62-140041 19870605; JPX62-316101 19871216; JPX62-327206 19871225; JPX63-270778 19881028; JPX1-090674 19890412
- 主分类号： C08G73/10
- IPC分类号： C08G73/10 ; C08L79/08 ; C08L81/04
摘要：
In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.