发明授权
- 专利标题： Sputtering electrode
- 专利标题（中）： 溅射电极
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申请号： US265019申请日： 1994-06-24
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公开(公告)号： US5512156A公开(公告)日： 1996-04-30
- 发明人: Hitoshi Yamanishi , Isamu Aokura , Toshiyuki Suemitsu , Takahiro Takisawa
- 申请人： Hitoshi Yamanishi , Isamu Aokura , Toshiyuki Suemitsu , Takahiro Takisawa
- 申请人地址： JPX Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX Osaka
- 优先权： JPX5-153234 19930624
- 主分类号： C23C14/35
- IPC分类号： C23C14/35 ; H01J37/34
摘要：
A magnetron sputtering electrode assembly which is used in a sputtering system having a rectangular flat-plate target, includes permanent magnets arranged along the longitudinal edges of the target to pass lines of magnetic forces in parallel to the surface of the rectangular flat-plate target, and a driving device for reversing polarity of the magnets to change by 180 degrees the direction of the lines of magnetic force caused by the permanent magnets passing in parallel to the surface of the rectangular flat-plate target.
公开/授权文献
- US6080001A Positive retention sleeve for modular connector 公开/授权日：2000-06-27