发明授权
US5512711A Copper-based paste containing refractory metal additions for
densification control
失效
含有难熔金属添加剂的铜基糊料用于致密化控制
- 专利标题： Copper-based paste containing refractory metal additions for densification control
- 专利标题（中）： 含有难熔金属添加剂的铜基糊料用于致密化控制
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申请号： US258896申请日： 1994-06-10
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公开(公告)号： US5512711A公开(公告)日： 1996-04-30
- 发明人: Lawrence D. David , Shaji Farooq , Anthony Mastreani , Srinivasa S-N. Reddy , Rao V. Vallabhaneni
- 申请人： Lawrence D. David , Shaji Farooq , Anthony Mastreani , Srinivasa S-N. Reddy , Rao V. Vallabhaneni
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01B1/16
- IPC分类号： H01B1/16 ; H01L23/498 ; H05K1/09 ; H05K3/46
摘要：
A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials. This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.
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