发明授权
US5514748A Polyimide based resin composition comprising cured phenolic resins and
liquid crystal polymers
失效
聚酰亚胺基树脂组合物，其包含固化的酚醛树脂和液晶聚合物
- 专利标题： Polyimide based resin composition comprising cured phenolic resins and liquid crystal polymers
- 专利标题（中）： 聚酰亚胺基树脂组合物，其包含固化的酚醛树脂和液晶聚合物
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申请号： US474380申请日： 1995-06-07
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公开(公告)号： US5514748A公开(公告)日： 1996-05-07
- 发明人: Toshihiko Isutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Katsunori Shimamura , Toshiaki Takahashi , Atsushi Morita , Nobuhito Koga , Akihiro Yamaguchi , Masahiro Ohta , Yoshihisa Gotoh , Masaki Amano , Hiroyasu Oochi , Kayako Ito
- 申请人： Toshihiko Isutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Katsunori Shimamura , Toshiaki Takahashi , Atsushi Morita , Nobuhito Koga , Akihiro Yamaguchi , Masahiro Ohta , Yoshihisa Gotoh , Masaki Amano , Hiroyasu Oochi , Kayako Ito
- 申请人地址： JPX Tokyo
- 专利权人： Mitsui Toatsu Chemicals, Inc.
- 当前专利权人： Mitsui Toatsu Chemicals, Inc.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-199058 19890730; JPX1-309100 19891130; JPX1-314394 19891205; JPX3-116153 19910521; JPX3-123350 19910528
- 主分类号： C08L67/00
- IPC分类号： C08L67/00 ; C08L71/00 ; C08L79/08 ; C08L67/02 ; C08L61/10
摘要：
A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.